Abstract: An embodiment plasma processing apparatus includes a plasma generation source, a nozzle in a plasma chamber, the nozzle being able to direct plasma from the plasma generation source to a wafer that is to be processed, the plasma having the form of a plasma stream at an exit of the nozzle, an outer annulus disposed in the plasma chamber and over the wafer, the outer annulus surrounding the nozzle, a gas exhaust disposed between inner sidewalls of the outer annulus and outer sidewalls of the nozzle, and a first vacuum pump connected to the gas exhaust between the inner sidewalls of the outer annulus and the outer sidewalls of the nozzle.

Abstract: An embodiment plasma processing apparatus includes a plasma generation source, a nozzle in a plasma chamber, the nozzle being able to direct plasma from the plasma generation source to a wafer that is to be processed, the plasma having the form of a plasma stream at an exit of the nozzle, an outer annulus disposed in the plasma chamber and over the wafer, the outer annulus surrounding the nozzle, a gas exhaust disposed between inner sidewalls of the outer annulus and outer sidewalls of the nozzle, and a first vacuum pump connected to the gas exhaust between the inner sidewalls of the outer annulus and the outer sidewalls of the nozzle.

Abstract: Cleaning systems and methods for semiconductor fabrication use rotatable and optionally translatable chuck assemblies that incorporate magnetic levitation and rotation functionality to cause chuck rotation. The rotating chuck components do not physically contact other chuck components when levitated and rotating. This eliminates corresponding components whose friction or lubricants might generate contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments. By avoiding the use of lubricants for this rotating interface, process chambers can be evacuated and/or vented up to higher pressures much faster. This significantly reduces cycle time for cryogenic treatments.

Abstract: The disclosure relates to systems and methods for metering a dose volume of fluid that may be used to treat microelectronic substrates. The system enables precision dispensing of relatively small amounts of a liquid chemical into a chemical bath or processing chamber for microelectronic substrates. The dispensing device may include a fluid conduit with a plurality of actuation devices that may limit fluid communication between the actuation devices and store a portion of the fluid in expandable membrane. The actuation devices may push or pull the fluid within the fluid conduit when the expandable membrane expands or contracts. The configuration and operation of the actuation devices may enable the collection, isolation, and dispensing of the dose volume.

Abstract: Cleaning systems and methods for semiconductor fabrication use rotatable and optionally translatable chuck assemblies that incorporate magnetic levitation and rotation functionality to cause chuck rotation. The rotating chuck components do not physically contact other chuck components when levitated and rotating. This eliminates corresponding components whose friction or lubricants might generate contamination. The low friction chuck functionality of the present invention is useful in any fabrication tool in which a workpiece is supported on a rotating support during a treatment. The chuck is particularly useful in cryogenic cleaning treatments. By avoiding the use of lubricants for this rotating interface, process chambers can be evacuated and/or vented up to higher pressures much faster. This significantly reduces cycle time for cryogenic treatments.

Abstract: The disclosure relates to systems and methods for metering a dose volume of fluid that may be used to treat microelectronic substrates. The system enables precision dispensing of relatively small amounts of a liquid chemical into a chemical bath or processing chamber for microelectronic substrates. The dispensing device may include a fluid conduit with a plurality of actuation devices that may limit fluid communication between the actuation devices and store a portion of the fluid in expandable membrane. The actuation devices may push or pull the fluid within the fluid conduit when the expandable membrane expands or contracts. The configuration and operation of the actuation devices may enable the collection, isolation, and dispensing of the dose volume.