Abstract: A method of forming a micro-electromechanical systems (MEMS) pixel, such as a DMD type pixel, by forming a substrate having a non-planar upper surface, and depositing a photoresist spacer layer upon the substrate. The spacer layer is exposed to a grey-scale lithographic mask to shape an upper surface of the spacer layer. A control member is formed upon the planarized spacer layer, and an image member is formed over the control member. The image member is configured to be positioned as a function of the control member to form a spatial light modulator (SLM). The spacer layer is planarized by masking a selected portion of the spacer layer with a grey-scale lithographic mask to remove binge in the selected portion.

Abstract: In described examples, a DMD includes an array of micromirror pixels. Each pixel includes a right electrode on a first side of the pixel, a left electrode on a second side of the pixel adjacent the first side, and a cantilevered beam supporting a mirror. The cantilever beam tilts on two axes of translation: pitch and roll. The mirror has: a first landed position (on a first and second spring tip) over the right electrode; and a second landed position (on the first and a third spring tip) over the left electrode, such that the first landed position and the second landed positions are 90° apart. In transitioning from the first landed position to the second landed position, the mirror maintains contact with the first spring tip while rolling from the second spring tip to the third spring tip.

Abstract: A method of forming a micro-electromechanical systems (MEMS) pixel, such as a DMD-type pixel, by depositing a photoresist spacer layer upon a substrate. The photoresist spacer layer is exposed to a grey-scale lithographic mask to shape an upper surface of the photoresist spacer layer. A control member is formed upon the shaped spacer layer, and has a sloped portion configured to maximize energy density. An image member is configured to be positioned as a function of the control member to form a spatial light modulator (SLM).

Abstract: In described examples, a DMD includes an array of micromirror pixels. Each pixel includes a right electrode on a first side of the pixel, a left electrode on a second side of the pixel adjacent the first side, and a cantilevered beam supporting a mirror. The cantilever beam tilts on two axes of translation: pitch and roll. The mirror has: a first landed position (on a first and second spring tip) over the right electrode; and a second landed position (on the first and a third spring tip) over the left electrode, such that the first landed position and the second landed positions are 90° apart. In transitioning from the first landed position to the second landed position, the mirror maintains contact with the first spring tip while rolling from the second spring tip to the third spring tip.

Abstract: A DMD having an array of micromirror pixels wherein each pixel comprises a right electrode on a first side of the pixel, a left electrode on a second side of the pixel adjacent the first side and a cantilevered beam supporting a mirror. The cantilever beam tilts on two axes of translation: pitch and roll. The mirror has a first landed position (on a first and second spring tip) over the right electrode and a second landed position (on the first and a third spring tip) over the left electrode such that the first landed position and the second landed positions are 90° apart. In transitioning from the first landed position to the second landed position, the mirror maintains contact with the first spring tip while rolling from the second spring tip to the third spring tip.

Abstract: A method of forming a micro-electromechanical systems (MEMS) pixel, such as a DMD-type pixel, by depositing a photoresist spacer layer upon a substrate. The photoresist spacer layer is exposed to a grey-scale lithographic mask to shape an upper surface of the photoresist spacer layer. A control member is formed upon the shaped spacer layer, and has a sloped portion configured to maximize energy density. An image member is configured to be positioned as a function of the control member to form a spatial light modulator (SLM).

Abstract: A method of forming a micro-electromechanical systems (MEMS) pixel, such as a DMD type pixel, by forming a substrate having a non-planar upper surface, and depositing a photoresist spacer layer upon the substrate. The spacer layer is exposed to a grey-scale lithographic mask to shape an upper surface of the spacer layer. A control member is formed upon the planarized spacer layer, and an image member is formed over the control member. The image member is configured to be positioned as a function of the control member to form a spatial light modulator (SLM). The spacer layer is planarized by masking a selected portion of the spacer layer with a grey-scale lithographic mask to remove binge in the selected portion.

Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (102), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom metal seed film (131) adhering to the substrate with a first width (131a), and further a top metal seed film (132) adhering to the cap with a second width (132a) smaller than the first width, the top metal seed film tied to a layer (135) including gold-indium intermetallic compounds, layer (135) having a height greater than the first height.

Abstract: A DMD having an array of micromirror pixels wherein each pixel comprises a right electrode on a first side of the pixel, a left electrode on a second side of the pixel adjacent the first side and a cantilevered beam supporting a mirror. The cantilever beam tilts on two axes of translation: pitch and roll. The mirror has a first landed position (on a first and second spring tip) over the right electrode and a second landed position (on the first and a third spring tip) over the left electrode such that the first landed position and the second landed positions are 90° apart. In transitioning from the first landed position to the second landed position, the mirror maintains contact with the first spring tip while rolling from the second spring tip to the third spring tip.

Abstract: A MEMS logic device comprising agate which pivots on a torsion hinge, two conductive channels on the gate, one on each side of the torsion hinge, source and drain landing pads under the channels, and two body bias elements under the gate, one on each side of the torsion hinge, so that applying a threshold bias between one body bias element and the gate will pivot the gate so that one channel connects the respective source and drain landing pad, and vice versa. An integrated circuit with MEMS logic devices on the dielectric layer, with the source and drain landing pads connected to metal interconnects of the integrated circuit. A process of forming the MEM switch.

Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (102), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom metal seed film (131) adhering to the substrate with a first width (131a), and further a top metal seed film (132) adhering to the cap with a second width (132a) smaller than the first width, the top metal seed film tied to a layer (135) including gold-indium intermetallic compounds, layer (135) having a height greater than the first height.

Abstract: A MEMS logic device comprising agate which pivots on a torsion hinge, two conductive channels on the gate, one on each side of the torsion hinge, source and drain landing pads under the channels, and two body bias elements under the gate, one on each side of the torsion hinge, so that applying a threshold bias between one body bias element and the gate will pivot the gate so that one channel connects the respective source and drain landing pad, and vice versa. An integrated circuit with MEMS logic devices on the dielectric layer, with the source and drain landing pads connected to metal interconnects of the integrated circuit. A process of forming the MEM switch.

Abstract: A MEMS logic device comprising agate which pivots on a torsion hinge, two conductive channels on the gate, one on each side of the torsion hinge, source and drain landing pads under the channels, and two body bias elements under the gate, one on each side of the torsion hinge, so that applying a threshold bias between one body bias element and the gate will pivot the gate so that one channel connects the respective source and drain landing pad, and vice versa. An integrated circuit with MEMS logic devices on the dielectric layer, with the source and drain landing pads connected to metal interconnects of the integrated circuit. A process of forming the MEM switch.

Abstract: A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.

Abstract: A method of actuating micromirror elements of a digital micromirror device is disclosed. A logic state is stored in the micromirror element including applying a negative voltage more negative than about ?5 volts to the micromirror element, applying a positive voltage less than about 5 volts to a first electrode, and applying ground to a second electrode. A first logic state is switched to a second logic state with an inverted waveform, including applying ground to the first electrode, applying a positive voltage less than 5 volts to the second electrode, applying a negative BSA voltage to the first electrode, applying a positive reset voltage pulse greater than about 10 volts, removing the negative BSA voltage, and applying the negative voltage to the micromirror element.

Abstract: In accordance with one embodiment of the present disclosure, a semiconductor substrate includes complementary metal-oxide-semiconductor (CMOS) circuitry disposed outwardly from the semiconductor substrate. An electrode is disposed outwardly from the CMOS circuitry. The electrode is electrically coupled to the CMOS circuitry. A resonator is disposed outwardly from the electrode. The resonator is operable to oscillate at a resonance frequency in response to an electrostatic field propagated, at least in part, by the electrode.

Abstract: A capacitive microphone transducer integrated into an integrated circuit includes a fixed plate and a membrane formed in or above an interconnect region of the integrated circuit. A process of forming an integrated circuit containing a capacitive microphone transducer includes etching access trenches through the fixed plate to a region defined for the back cavity, filling the access trenches with a sacrificial material, and removing a portion of the sacrificial material from a back side of the integrated circuit.

Abstract: In accordance with one embodiment of the present disclosure, a semiconductor substrate includes complementary metal-oxide-semiconductor (CMOS) circuitry disposed outwardly from the semiconductor substrate. An electrode is disposed outwardly from the CMOS circuitry. The electrode is electrically coupled to the CMOS circuitry. A resonator is disposed outwardly from the electrode. The resonator is operable to oscillate at a resonance frequency in response to an electrostatic field propagated, at least in part, by the electrode.

Abstract: In accordance with the teachings of the present invention, a spatial light modulator mirror metal having enhanced reflectivity is provided. In a particular embodiment of the present invention, a light processing system includes a light source operable to provide a light beam along a light path and a spatial light modulator positioned in the light path, the spatial light modulator comprising an array of pixel elements, each pixel element comprising a deformable micro-mirror operable to reflect the light beam in at least one direction. At least a portion of each deformable micro-mirror comprises an Al—Cu alloy. A controller electrically connected to the spatial light modulator is operable to provide electrical signals to the spatial light modulator to cause the spatial light modulator to selectively deform the pixel elements, thereby selectively reflecting incident light beams along a projection light path.

Abstract: In accordance with the teachings of the present invention, a spatial light modulator mirror metal having enhanced reflectivity is provided. In a particular embodiment of the present invention, a light processing system includes a light source operable to provide a light beam along a light path and a spatial light modulator positioned in the light path, the spatial light modulator comprising an array of pixel elements, each pixel element comprising a deformable micro-mirror operable to reflect the light beam in at least one direction. At least a portion of each deformable micro-mirror comprises an Al—Cu alloy. A controller electrically connected to the spatial light modulator is operable to provide electrical signals to the spatial light modulator to cause the spatial light modulator to selectively deform the pixel elements, thereby selectively reflecting incident light beams along a projection light path.