Abstract: A dual inline memory module (DIMM) connector has pins to connect to pad footprints and signal routing that reduces crosstalk and noise. The shape and placement of ground pads and signal pads can improve grounding of noise signals and improve the signal isolation on the signal pins. The ground pads can have additional ground vias to increase the ground path to the ground plane.

Abstract: A dual inline memory module (DIMM) connector has pins to connect to pad footprints and signal routing that reduces crosstalk and noise. The signals pins are staggered with alternating signal pins being longer and shorter. Longer pins have corresponding signal pads on the system board farther away from the connector than corresponding signals pads for the shorter pins.

Abstract: Small form factor shunted socket pins and configurations for improved single ended signaling. The shunted socket pin includes a cantilevered spring member coupled to an upper portion of a body having a lower lever directed in a first direction coupled to an upper lever directed in a second direction to form a nose, the cantilevered spring member folding back on itself, and a shunting lever, coupled to the upper portion of the body. The body is coupled to a base, such as a solder ball. When the socket pin is compressed, a portion of the shunting lever is in contact with a portion of the cantilevered member, creating a shunted (and shorter) electrical path between contact pads on a socketed IC, SoC, or SoP and a contact pad or via on a PCB to which the solder ball is coupled.

Abstract: Apparatus and methods for conductive memory module notch and connector-to-motherboard pins for power or ground. A memory module includes a conductive notch that is coupled to either one or more ground planes in respective layers in the memory module's PCB or to a power rail formed on one or more layers in the PCB. A memory module connector includes a notch pin that is configured to mate with the conductive notch when the memory module is installed in the connector. The connector is mounted to a motherboard or the like and the notch pin is coupled to either power (e.g., Vin) or ground in the motherboard. When coupled to power, Vin is supplied to the memory module via the notch pin/conductive notch. When coupled to ground on the motherboard, at least a portion of the ground planes in the PCB are coupled to ground via the notch pin/conductive notch.

Abstract: Compression Attached Memory Module (CAMM) connector pin with multi-spring (dual bend direction) levers and associated connectors. The connector pin comprises an upper cantilevered spring member coupled to an upper portion of a body and a lower cantilevered spring member coupled to a lower portion of the body. Each of the upper and lower cantilevered spring members include at least one forward bending lever and a backward bending lever. The upper cantilevered spring member may have a pair of arms merging to form an upper unified spring member having a nose and looping backwards over the arms and having an apex. A lower cantilevered spring may have a pair of legs merging to form a lower unified spring member having a nose and looping backwards under the legs and having a bottom. When compressed the forward and backward bending levers counteract one another in the horizontal plane, reducing horizontal displacement.

Abstract: A circuit board includes vias with a coil structure. A circuit board includes vias with barrels that extend vertically through the circuit board and pads in different planes of the circuit board, such as the top surface and bottom surface, and optionally in an inner routing layer. The coil structure is a coil of conductor in a plane of the circuit board, electrically connected to a pad in that plane, which is electrically connected to the barrel. The coil structure provides self-inductance around the pad, which brings up the reactive impedance of the via to balance the capacitive reactance of the via.

Abstract: An apparatus and method for reducing differential cross-talk in a pin arrangement of a socket are described. Socket pins within a differential pair use a modified shape to tighten the intra-pair pin coupling to reduce the crosstalk without changing the pin map. The middle vertical segment of one pin of a diagonally adjacent differential pin pair is modified to be closer to the other pin than other corresponding locations of the pins. The spring beam that extends from the middle vertical segment of the one pin is modified to accommodate the package landing pad that the spring beam contacts to maintain a uniform pitch.

Abstract: Examples described herein relate to a system that includes: a circuit board comprising a plurality of layers, first and second conductive connections, first and second trace portions, first, second, and third routings, and a via wherein: the first conductive connection is coupled to the first trace portion, the second conductive connection is coupled to the second trace portion, the first routing is formed in a first layer of the plurality of layers, the second routing is formed in a second layer of the plurality of layers, the third routing is formed in the first layer of the plurality of layers, a portion of the first routing overlaps with a portion of the second routing to provide a capacitive region, and the via conductively couples a portion of the second routing overlaps with a portion of the third routing.

Abstract: Examples described herein relate to a system that includes: a circuit board comprising a plurality of layers and at least one conductive connection. In some examples, the at least one conductive connection is connected to a layer of the plurality of layers. In some examples, at least one layer of the plurality of layers comprises a conductive material. In some examples, the at least two layers of the plurality of layers comprise conductive material that extend in an axis towards the at least one conductive connection but do not overlap with the at least one layer of the plurality of layers comprising the conductive material.

Abstract: Examples described herein relate to a system that includes: a first signal pin and a first ground pin adjacent to the first signal pin. In some examples, the first signal pin comprises a first portion, a second portion, and a third portion. In some examples, the first ground pin comprises a first portion, a second portion, and a third portion, the second portion of the first signal pin comprises a vertical mount, the second portion of the first ground pin comprises a vertical mount, and the second portion of the first signal pin and the second portion of the first ground pin are arranged proximate one another.

Abstract: An embodiment of an electronic apparatus comprises a circuit board, one or more memory devices affixed to a top side of the circuit board, and one or more board-to-board connectors affixed to a bottom side of the circuit board to provide an external connection to signals of the one or more memory devices, where the one or more board-to-board connectors are located inward from outermost edges of the circuit board and where a first footprint defined by an outermost boundary of the one or more board-to-board connectors is substantially a same size as or smaller than a second footprint defined by an outermost boundary of the one or more memory devices. Other embodiments are disclosed and claimed.