Abstract: Provided is a microphone, including a base having a back cavity, a diaphragm, a backplate electrode, and a backplate spaced from the diaphragm and defining an inner cavity jointly with the diaphragm. The diaphragm includes a vibration portion, a fixing portion, and a leak hole. The back cavity is communicated with the inner cavity through the leak hole. The backplate is provided with a first through hole. The inner cavity is communicated with outside through the first through hole. The backplate includes a backplate body and a backplate extension portion. The inner cavity includes a first inner cavity and a second inner cavity. The backplate extension portion is provided with a second through hole, and the second inner cavity is communicated with outside through the second through hole. A method for manufacturing the microphone is further provided. The technical solution has better drop performance.

Abstract: Provided is a microphone, including a base having a back cavity, a diaphragm, a backplate electrode, and a backplate spaced from the diaphragm and defining an inner cavity jointly with the diaphragm. The diaphragm includes a vibration portion, a fixing portion, and a leak hole. The back cavity is communicated with the inner cavity through the leak hole. The backplate is provided with a first through hole. The inner cavity is communicated with outside through the first through hole. The backplate includes a backplate body and a backplate extension portion. The inner cavity includes a first inner cavity and a second inner cavity. The backplate extension portion is provided with a second through hole, and the second inner cavity is communicated with outside through the second through hole. A method for manufacturing the microphone is further provided. The technical solution has better drop performance.

Abstract: The invention provides a method for preparing a MEMS conductive part and a conductive coating. A conductive unit includes a fixed member, a moving member which can reciprocate relative to the fixed member, and a plurality of groups of conductive electroplating layers which are electrically connected with the moving member and the fixed member, the moving member includes a first wall and a second wall connected with the first wall, and the fixed member includes a first wall connected with the first wall. The end components (fixed and moving components) displace relatively freely and transmit electric signals at the same time.

Abstract: A deep cavity etching method is disclosed. The deep cavity includes a large cavity and a small cavity forming a step. The method includes the following steps: providing a silicon substrate containing at least an upper surface; forming an oxide layer on the upper surface of the silicon substrate; and coating the first photoresist on the side of the oxide layer away from the silicon substrate. The deep cavity of the step avoids the photoresist spraying process with higher efficiency and lower cost, reduces the process cost and improves the production capacity.