Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.

Abstract: A decoupled XY parallel micro-positioning stage, including a central moving platform, fixed mechanisms, bridge-type micro-displacement amplification mechanisms, a four-bar symmetrical flexible guide mechanism and a piezoelectric ceramic. Each fixed mechanism is arranged between adjacent amplification mechanisms and is symmetrical about X and Y axes centered on the moving platform. The amplification mechanism is symmetrically arranged with respect to the X and Y axes, and includes two first and second longitudinal beams and multiple crossbeams. The two first longitudinal beams are provided in parallel and spaced apart. The two second longitudinal beams are arranged spaced apart between the two first longitudinal beams, and are connected to the two first longitudinal beams via the crossbeams. The crossbeams are connected to the longitudinal beams via a flexible hinge. The piezoelectric ceramic is arranged between the two first longitudinal beams.

Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.

Abstract: The disclosure relates to a method for repairing an internal circuit break defect in a chip, including: S1, detecting the defect position of the chip and the type and performance parameters of a filling material; S2, positioning the chip on a two-dimensional motion platform; S3, setting parameters of two beams of laser; adjusting a focal length of the two beams of laser three-dimensional incident angle and a Z axis, so that a focus point of the two beams of laser irradiate any end of the circuit break of the chip; S4, the two-dimensional motion platform drives the chip to move, so that the focus point of the two beams of laser is moved to an other end of the circuit break, and an moving trajectory of the focus point of the two beams of laser feeds through the two ends of the circuit break of the chip.

Abstract: A fast clustering algorithm of kernel fuzzy C-means integrated with spatial constraints, including (1) applying the illumination processing algorithm, the preprocessed image affected by illumination is constructed; (2) After step (1), the original image and preprocessed image are mapped to the feature space using Gaussian kernel to cluster and segment. Providing a defect segmentation method for fluorescent glue which is robust to illumination to process and calculate the illuminated image, so as to complete the detection of foreign matters, bubbles and discoloration defects of fluorescent glue in lighting products. The disclosure provides a fast clustering algorithm of kernel fuzzy C-means integrated with spatial constraints.

Abstract: A composite sine-trapezoidal fringe structured light 3D measurement method includes projecting trapezoidal fringe patterns onto a measured object and capturing fringe images; sorting the fringe images by brightness, resolving them into uniform light images and sinusoidal light images, and obtaining a sub-region ordinal number of each image; using the uniform light image to identify a strength response model of the captured fringe image, and obtaining a strength response model parameter; an actual projection strength, a sub-region phase of the sinusoidal light image according to the actual projection strength, a wrapped phase according to sub-region phase and sub-region ordinal number, an absolute phase according to the wrapped phase and sub-region ordinal number, a surface point of the measured object at the positions of a projector pixel and a camera pixel according to the absolute phase, and an object surface model of the measured object by a reconstruction by triangulation.