Patents by Inventor Lanyue DOU

Lanyue DOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230078935
    Abstract: The present application relates to the field of electronic product heat dissipation component and in particular, relates to a graphene thermally conductive gasket edge-wrapped process and an edge-wrapped graphene thermally conductive gasket. The process steps are: coating a layer of adhesive on the first layer of graphene film, placing the second layer of graphene film on the first layer of graphene film, repeating stacking to the target height, obtaining a graphene film block, punching a plurality of through holes penetrating two surfaces of the graphene film block; threading the carbon fiber through the through holes after coating an adhesive on the surface thereof; slicing along the direction parallel to the thickness direction of the graphene film, to obtain the graphene thermally conductive gasket with a specified thickness; and coating a layer of glue on the peripheral sides of the graphene thermally conductive gasket to form an edge-wrapped layer.
    Type: Application
    Filed: January 20, 2022
    Publication date: March 16, 2023
    Inventors: Yong Cao, Aixiang Sun, Shangqiang Yang, Xichang He, Lanyue Dou, Xiaoyan Zhou
  • Patent number: 11313631
    Abstract: A composite server heat sink with a metal base having a thermal conductivity of at least 200W/mK. Plural fins extend from the metal base, each fin having an anisotropic thermal conductivity in a range of approximately 300 to 650 W/mK in a longitudinal direction of the fin and less than approximately 30 W/mK in a widthwise direction of the fin. Each fin includes graphite in an amount of approximately 45-70 wt. %, diamond in an amount of approximately 2.5 to 10 wt. % with the balance comprising a metal selected from one or more of copper and aluminum. To create the anisotropic thermal properties, the graphite is aligned along the longitudinal direction of the fin.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: April 26, 2022
    Assignee: HFC Industry Limited
    Inventors: Xiaohua Chen, Chi Ho Kwok, Chenmin Liu, Ai Xiang Sun, Lanyue Dou
  • Publication number: 20220011059
    Abstract: The present invention provides a composite server heat sink with a metal base having a thermal conductivity of at least 200 W/mK. Plural fins extend from the metal base, each fin having an anisotropic thermal conductivity in a range of approximately 300 to 650 W/mK in a longitudinal direction of the fin and less than approximately 30 W/mK in a widthwise direction of the fin. Each fin includes graphite in an amount of approximately 45-70 wt. %, diamond in an amount of approximately 2.5 to 10 wt. % with the balance comprising a metal selected from one or more of copper and aluminum. To create the anisotropic thermal properties, the graphite is aligned along the longitudinal direction of the fin.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 13, 2022
    Inventors: Xiaohua CHEN, Chi Ho KWOK, Chenmin LIU, Ai Xiang SUN, Lanyue DOU