Patents by Inventor Lap Van Hoang

Lap Van Hoang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6856730
    Abstract: An athermal package for fiber photonic devices includes at least two bonding regions at each end of the optical fiber containing the photonic device. At each end of the optical fiber, the bonding region nearest the photonic device (i.e., the inner bonding region) has a width that is less than that of the other bonding region (i.e., the outer bonding region). The smaller widths of the inner bonding regions allow for relatively precise control of the positions on the optical fiber that the inner bonding regions are attached. The larger widths of the outer bonding regions help provide reliable attachments.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: February 15, 2005
    Assignee: Intel Corporation
    Inventors: Alan E. Johnson, Edward P. Donlon, Frank D. Braun, Lap Van Hoang
  • Publication number: 20040013364
    Abstract: An athermal package for fiber photonic devices includes at least two bonding regions at each end of the optical fiber containing the photonic device. At each end of the optical fiber, the bonding region nearest the photonic device (i.e., the inner bonding region) has a width that is less than that of the other bonding region (i.e., the outer bonding region). The smaller widths of the inner bonding regions allow for relatively precise control of the positions on the optical fiber that the inner bonding regions are attached. The larger widths of the outer bonding regions help provide reliable attachments.
    Type: Application
    Filed: July 22, 2002
    Publication date: January 22, 2004
    Inventors: Alan E. Johnson, Edward P. Donlon, Frank D. Braun, Lap Van Hoang