Patents by Inventor Lap Yu Jessie Chan

Lap Yu Jessie Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transfer molding method and system for electronic devices
    Patent number: 7829004
    Abstract: A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: November 9, 2010
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Shu Chuen Ho, Jian Wu, Lap Yu Jessie Chan
  • TRANSFER MOLDING METHOD AND SYSTEM FOR ELECTRONIC DEVICES
    Publication number: 20100013120
    Abstract: A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.
    Type: Application
    Filed: July 15, 2008
    Publication date: January 21, 2010
    Inventors: Shu Chuen HO, Jian WU, Lap Yu Jessie CHAN