Abstract: A process for preparing an epoxy resin and a process for preparing a hardened and cured epoxy resin adhesive is provided, together with the epoxy resins and adhesives made thereby. The epoxy resin is prepared by mixing together about 76 parts per hundred of a novolac epoxy resin, about 19 parts per hundred of a bisphenol F epoxy resin, and about 5 parts per hundred of carboxy-terminated butadiene acrylonitrile, heating the mixture to a temperature of from about 290 to about 350 degrees Fahrenheit for a time of from about two to about three hours, and then cooling. An epoxy adhesive is prepared by mixing 100 parts of the material so prepared with about 20 parts of a curing agent consisting essentially of diethyltriamine. The resulting adhesive mixture has a paste-like consistency that is easily applied and cured at ambient temperature. The shear strength of the cured adhesive is about 4000 psi at ambient temperature and about 2000 psi at 250 degrees Fahrenheit.

Abstract: A one-piece gasket is used between millimeter waveguide sections to prevent energy leakage from the joint. The gasket consists of an electrically conductive elastomeric ring filled with metallic particles, a conformable metallic inner shield on the inner periphery of the ring, and a conformable metallic outer shield on the outer periphery of the ring. The gasket is conveniently prepared by casting the filled elastomer in place between the shields.

Abstract: Conductive, adherent, non-magnetic deposits are formed on quartz glass by first applying a thin gold layer to the glass, and then depositing silver over the gold. The gold is deposited directly onto a very clean quartz glass substrate from an organo-metallic compound, and then fired to produce a metallic gold layer no more than about 5 microinches thick. A silver layer is deposited over the gold by first laying down a thin strike layer at high voltage, and then electrodepositing a further silver layer under a controlled current density. During the deposition of the final silver layer, the current is preferably applied in a periodic reverse current-pulse manner. Prior to depositing the gold layer, the quartz glass may be cleaned by wiping with acetone and baking in a vacuum to remove further contamination.