Abstract: A connector for coupling an electronic component having an external connector pad to another structure, comprising an anisotropic conductive elastomer or adhesive composite comprising a plurality of separate columns of conductive particles held in an insulating matrix, with a top particle exposed to a surface of the matrix, wherein at least the top particle is coated with a metal that can permanently bond to the connector pad of the electronic component. Also disclosed are a related method, and a related electronic assembly.

Abstract: A spring pin-based electrical interconnect system with a non-conductive socket body, a spring pin located in part in the socket body and defining two ends, an anisotropically-conductive elastomeric sheet with first and second opposed surfaces wherein the first surface is in contact with a first end of the spring pin. A PCB is in contact with the second surface of the elastomeric sheet.

Abstract: A device for testing integrated circuits utilizing a compression spring that has one longitudinal centerline that is concentric to the housing of the test probe and terminates in a number of reduced diameter coil windings that are non-concentric to the housing so as to provide a side load to the probe.

Abstract: A test apparatus for testing electrical devices such as ICs is provided. The test apparatus includes a test socket mounted on a DUT board in which a contact plunger assembly is at least partially positioned.

Abstract: Disclosed herein is an electronic test probe including a compression spring disposed in the housing in engagement with a plunger, the compression spring including a first section of coils including a first centerline and a second section of coils including a second centerline spaced apart from and parallel to the first centerline.

Abstract: A test apparatus for testing electrical devices such as ICs is provided. The test apparatus includes a test socket mounted on a DUT board in which a contact plunger assembly is at least partially positioned.

Abstract: An electrical socket (10) mounts a plurality of electrical contact probes (20, 22, 24, 26, 28, 30, 32) for providing an electrical connection between terminals of an electronic package (1,1′) received in a seat (10d) formed in the socket and respective conductive pads of a DUT board. The contact probes each have a slidable contact tip (20m, 26m, 28m, 30m, 32m) which is adapted for engagement with a respective terminal of an electronic package received in the socket and which is removable from the contact probe for ease of replacement. The removable contact tips or plungers are provided with a retainer surface (20t, 28t, 30t, 32t) for interengagement with a removable retainer member of the socket.

Abstract: A test apparatus for testing electrical devices such as ICs is provided. The test apparatus includes a test socket mounted on a DUT board in which a contact plunger assembly is at least partially positioned.

Abstract: An electrical socket (10) mounts a plurality of electrical contact probes (20,22,24,26,28,30,32) for providing an electrical connection between terminals of an electronic package (1,1′) received in a seat (10d) formed in the socket and respective conductive pads of a DUT board. The contact probes each have a slidable contact tip (20m,26m,28m,30m,32m) which is adapted for engagement with a respective terminal of an electronic package received in the socket and which is removable from the contact probe for ease of replacement. The removable contact tips or plungers are provided with a retainer surface (20t,28t,30t, 32t) for interengagement with a removable retainer member of the socket.