Abstract: Methods of fabricating graphene for device application are described herein. The method comprises growing a graphene film on a copper substrate using chemical vapor deposition (CVD), transferring the graphene film from the copper substrate to a device substrate, doping the graphene film with gold(III) chloride (AuCl3); and patterning the graphene film. The graphene film has a transmittance of at least 97% in visible to infrared range and a sheet resistance of less than 200 Ohms per square. The graphene film can be used as a transparent conductive electrode in, among others, a microshutter array on a space telescope.

Abstract: An optical waveguide device including an electro-optical crystal substrate having a top surface and a bottom surface; an optical waveguide path formed within a surface of the electro-optical crystal substrate; at least one electrode positioned above the optical waveguide path for applying an electric field to the optical waveguide path; and a silicon titanium oxynitride layer and a connecting layer for interconnecting the silicon titanium oxynitride layer to another surface of the electro-optical crystal substrate that is opposite to the surface in which the optical waveguide path is formed.

Abstract: An optical waveguide device including an electro-optical crystal substrate having a top surface and a bottom surface; an optical waveguide path formed within a surface of the electro-optical crystal substrate; at least one electrode positioned above the optical waveguide path for applying an electric field to the optical waveguide path; and a silicon titanium oxynitride layer and a connecting layer for interconnecting the silicon titanium oxynitride layer to another surface of the electro-optical crystal substrate that is opposite to the surface in which the optical waveguide path is formed.

Abstract: An optical waveguide device including an electro-optical crystal substrate having a top surface and a bottom surface; an optical waveguide path formed within a surface of the electro-optical crystal substrate; at least one electrode positioned above the optical waveguide path for applying an electric field to the optical waveguide path; and a silicon titanium oxynitride layer and a connecting layer for interconnecting the silicon titanium oxynitride layer to another surface of the electro-optical crystal substrate that is opposite to the surface in which the optical waveguide path is formed.

Abstract: An optical waveguide device including an electro-optical crystal substrate having a top surface and a bottom surface; an optical waveguide path formed within a surface of the electro-optical crystal substrate; at least one electrode positioned above the optical waveguide path for applying an electric field to the optical waveguide path; and a silicon titanium oxynitride layer and a connecting layer for interconnecting the silicon titanium oxynitride layer to another surface of the electro-optical crystal substrate that is opposite to the surface in which the optical waveguide path is formed.

Abstract: An optical waveguide device including an electro-optical crystal substrate having a top surface and a bottom surface; an optical waveguide path formed within a surface of the electro-optical crystal substrate; at least one electrode positioned above the optical waveguide path for applying an electric field to the optical waveguide path; and a silicon titanium oxynitride layer and a connecting layer for interconnecting the silicon titanium oxynitride layer to another surface of the electro-optical crystal substrate that is opposite to the surface in which the optical waveguide path is formed.

Abstract: An integrated optical device is made starting with a substrate of lithium niobate. A fluoropolymer solution is applied to coat at least part of the substrate. The substrate having fluoropolymer coat is prepared such that a metal film will adhere to the fluoropolymer coating. Next, an electrode is created by applying a metal film to the fluoropolymer coat. The preparing step is preferably accomplished by heating the substrate with the fluoropolymer coating on it such that the fluoropolymer coating is annealed, the annealing of the fluoropolymer coating improving the adhesion of the metal film to the fluoropolymer coating. Alternately, the preparing of the substrate having fluoropolymer coating includes, simultaneously with the application of the metal film, cooling the substrate with the fluoropolymer coating by contacting a thermal sink with the substrate with the fluoropolymer coating.