Patents by Inventor Larry A. LaFollette

Larry A. LaFollette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
    Publication number: 20040159050
    Abstract: A novel CMP slurry composition used for polishing metals, the composition comprising: a dispersion solution comprising an abrasive. The slurry composition has a large particle count of about 25 to about 150,000 particles having a particle size greater than 0.5 &mgr;m in 30 &mgr;L of slurry, which is achieved by filtering the slurry composition prior to use. Also, the inclusion of a chemical activity enhancer, such as, an amine and a corrosion inhibitor, results in the appropriate copper removal rate without increasing static etch rates.
    Type: Application
    Filed: December 1, 2003
    Publication date: August 19, 2004
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Anthony Mark Pasqualoni, Deepak Mahulikar, Larry A. LaFollette, Richard J. Jenkins
  • Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
    Patent number: 6749488
    Abstract: The invention relates to a novel CMP slurry composition used for polishing metals, the composition comprising: (a) a dispersion solution comprising an abrasive; and (b) an oxidizer. The slurry composition has a large particle count of less than about 150,000 particles having a particle size greater than 0.5 &mgr;m in 30 &mgr;L of slurry, which is achieved by filtering the slurry composition prior to use. Also, the inclusion of a chemical activity enhancer, such as, an amine and a corrosion inhibitor, results in the appropriate copper removal rate without increasing static etch rates.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: June 15, 2004
    Assignee: Planar Solutions LLC
    Inventors: Anthony Mark Pasqualoni, Deepak Mahulikar, Larry A. LaFollette, Richard J. Jenkins
  • Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
    Publication number: 20030104770
    Abstract: The invention relates to a novel CMP slurry composition used for polishing metals, the composition comprising: (a) a dispersion solution comprising an abrasive; and (b) an oxidizer. The slurry composition has a large particle count of less than about 150,000 particles having a particle size greater than 0.5 &mgr;m in 30 &mgr;L of slurry, which is achieved by filtering the slurry composition prior to use. Also, the inclusion of a chemical activity enhancer, such as, an amine and a corrosion inhibitor, results in the appropriate copper removal rate without increasing static etch rates.
    Type: Application
    Filed: April 30, 2001
    Publication date: June 5, 2003
    Applicant: ARCH SPECIALTY CHEMICALS, INC.
    Inventors: Anthony Mark Pasqualoni, Deepak Mahulikar, Larry A. LaFollette, Richard J. Jenkins
  • Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
    Publication number: 20030064671
    Abstract: The invention relates to a novel CMP slurry composition used for polishing metals, the composition comprising: (a) a dispersion solution comprising an abrasive; and (b) an oxidizer. The slurry composition has a large particle count of less than about 150,000 particles having a particle size greater than 0.5 &mgr;m in 30 &mgr;L of slurry, which is achieved by filtering the slurry composition prior to use. Also, the inclusion of a chemical activity enhancer, such as, an amine and a corrosion inhibitor, results in the appropriate copper removal rate without increasing static etch rates.
    Type: Application
    Filed: October 9, 2002
    Publication date: April 3, 2003
    Applicant: Arch Specialty Chemicals, Inc.
    Inventors: Anthony Mark Pasqualoni, Deepak Mahulikar, Larry A. LaFollette, Richard J. Jenkins