Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.

Abstract: An earphone device capable of achieving sound bandwidths beyond the 150-7000 Hz wideband range, and configured for supra-concha or supra-aural placement. The earphone comprises at least two frequency range receivers positioned within a housing. In at least one embodiment, the earphone is capable of achieving a super-wideband range by physically combining a low frequency range receiver and a high frequency range receiver in a space-efficient and acoustically advantageous manner.

Abstract: The microphone system for communication devices that comprises an electric circuit comprising two microphone elements connected to a signal flow processor. This processor uses a digital signal processor or comparable analog circuitry to provide a particular electrical time delay (?) to one of the microphone elements (nearest the ear or loudspeaker) and a compatible amplitude gain (Gm1) to the other microphone element (nearest the user's mouth) in order to substantially reduce the external acoustic coupling and echo of communication devices in the receive and doubletalk state. Further, this processing system allows the microphone system to reduce the pickup of ambient noise in the send and idle state, while still being sensitive to the user's speech.

Abstract: An earphone device capable of achieving sound bandwidths beyond the 150-7000 Hz wideband range, and configured for supra-concha or supra-aural placement. The earphone comprises at least two frequency range receivers positioned within a housing. In at least one embodiment, the earphone is capable of achieving a super-wideband range by physically combining a low frequency receiver and a high frequency receiver in a space-efficient and acoustically advantageous manner.

Abstract: A compact telephone handset, when not in use, is shorter in length than the distance between a user's ear and mouth and has an extendable boom for lengthening the telephone to a length equal to the distance between the user's ear and mouth. The handset has a receiver device and a microphone device with one of the devices being located on the main body of the handset and the other device being located on a slidable boom which is extendable and retractable relative to the main body.

Abstract: In accordance with the invention, a new type of microphone utilizes a magnetoresistive sensing element. Specifically, acoustical energy causes vibrations between a magnetoresistive element and a magnet, producing a variation in the resistance which can be used to convert an acoustical signal into a corresponding electrical signal.

Abstract: Coupling apparatus for a telephone handset comprises a handset-coupling cradle having a dome at one end thereof for locating the earpiece (receiver) of the handset, and sound ports at the other end of the cradle in the region where the mouthpiece (microphone) of the handset resides. The handset-coupling cradle is shaped to accommodate a variety of different handset styles. An inductive sensor is mounted within the dome and it responds to electromagnetic fields generated by the handset receiver. Such a sensor eliminates the need to closely couple the receiver to the apparatus. A low acoustic impedance loudspeaker is mounted beneath the sound ports for acoustically coupling signals to the handset's microphone. Such a loudspeaker eliminates the need to closely couple the microphone to the apparatus.