Abstract: Apparatus and method for an educational game hoop that may be rolled or spun on the ground by a player or rotated about the body, waist, neck, or arms of a player. The educational game hoop has a plurality of questions and corresponding answers on the hoop surface. The plurality of questions are preferably on at least one hoop surface and the plurality of corresponding answers are preferably on at least one other hoop surface.

Abstract: Systems and methods for managing human resources are provided. In one embodiment, a resource management system includes a network resource management server including at least one database containing data related to human resources and at least one resource management system application. The resource management system may further include business rules that, when applied to the human resource data, generates an action. Access to the system can be provided to both an employer and employee by telephone or electronically for efficient and standardized processing of a leave request.

Abstract: An integrated circuit package is provided with a ball landing area having a conductive structure for interlocking a conductive ball to the ball pad. The conductive structure improves the attachment strength between an integrated circuit package and an printed circuit board. In an exemplary embodiment, the locking structure is a conductive material added to the surface of the ball pad to provide a nonplanar interface, such as a dome or a step, which interlocks the conductive ball to the ball pad. The improved package construction increases the area of contact, moves the shear plane to a higher and larger portion on the conductive ball, and/or prevents a crack from propagating along a flat plane across the ball joint. This package construction maintains the small size of the ball land areas and the package, increases the life of the integrated circuit package, while offsetting the problem of package warpage.

Abstract: The present invention provides, in one embodiment, a method of reducing 1/f noise in a metal oxide semiconductor (MOS) device (100). The method comprises forming an oxide layer (110) on a silicon substrate (105) and depositing a polysilicon layer (115) on the oxide layer (110). The method further includes implanting a fluorine dopant (130) into the polysilicon layer (115) at an implant dose of at least about 4×1014 atoms/cm2. The polysilicon layer (115) is thermally annealed such that a portion of the fluorine dopant (130) is diffused into the oxide layer (110) to thereby reduce a 1/f noise of the MOS device (100). Other embodiments of the provide a MOS device (300) manufactured by the above-described method and a method of manufacturing an integrated circuit (500) that includes the above-described method.

Abstract: A hydraulic motor comprising a housing having a fluid inlet. A fluid outlet and a cavity there between, a pair of intermeshing gear elements rotatable in the housing about mutually parallel axes. Each of the gear elements having a set of gear teeth disposed about the periphery of the element and a support shaft extending from oppositely directed end faces of the set of gear teeth. A bearing assembly located on opposite sides of the cavity in said housing to support the shafts for rotation about respective ones of the axes. Each of the bearing assemblies having a sealing face overlying the end faces and biased into engage with the end faced by a pressure compensating seal located between the bearing and the housing. The sealing face having a channel extending partially about the spindle and in fluid communication with the inlet to introduce fluid under pressure between the faces.

Abstract: A hydraulic motor comprising a housing having a fluid inlet. A fluid outlet and a cavity there between, a pair of intermeshing gear elements rotatable in the housing about mutually parallel axes. Each of the gear elements having a set of gear teeth disposed about the periphery of the element and a support shaft extending from oppositely directed end faces of the set of gear teeth. A bearing assembly located on opposite sides of the cavity in said housing to support the shafts for rotation about respective ones of the axes. Each of the bearing assemblies having a sealing face overlying the end faces and biased into engage with the end faced by a pressure compensating seal located between the bearing and the housing. The sealing face having a channel extending partially about the spindle and in fluid communication with the inlet to introduce fluid under pressure between the faces.

Abstract: A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.

Abstract: A semiconductor package includes a relatively thin substrate epoxy attached to a packaging substrate, such as a lead frame. A relatively thick semiconductor epoxy is attached to a semiconductor. The relatively thin substrate epoxy and the relatively thick semiconductor epoxy are attached to one another forming a stack including the packaging substrate, the relatively thin substrate epoxy, the relatively thick semiconductor epoxy, and the semiconductor. A housing encloses the stack.

Abstract: An integrated circuit package is provided with a ball landing area having a conductive structure for interlocking a conductive ball to the ball pad. The conductive structure improves the attachment strength between an integrated circuit package and an printed circuit board. In an exemplary embodiment, the locking structure is a conductive material added to the surface of the ball pad to provide a nonplanar interface, such as a dome or a step, which interlocks the conductive ball to the ball pad. The improved package construction increases the area of contact, moves the shear plane to a higher and larger portion on the conductive ball, and/or prevents a crack from propagating along a flat plane across the ball joint. This package construction maintains the small size of the ball land areas and the package, increases the life of the integrated circuit package, while offsetting the problem of package warpage.

Abstract: An integrated circuit package is constructed to potential reduce stress and damage to an integrated circuit die. A rigid transition medium (220) is attached using adhesive layers (215, 42) and interfaces between a tape carrier (260) and the integrated circuit die (210). The integrated circuit package prevents damage such as die cracks and also enhances the service life of the packaged integrated circuit part.

Abstract: An integrated circuit package is provided with a ball landing area having a conductive structure for interlocking a conductive ball to the ball pad. The conductive structure improves the attachment strength between an integrated circuit package and an printed circuit board. In an exemplary embodiment, the locking structure is a conductive material added to the surface of the ball pad to provide a nonplanar interface, such as a dome or a step, which interlocks the conductive ball to the ball pad. The improved package construction increases the area of contact, moves the shear plane to a higher and larger portion on the conductive ball, and/or prevents a crack from propagating along a flat plane across the ball joint. This package construction maintains the small size of the ball land areas and the package, increases the life of the integrated circuit package, while offsetting the problem of package warpage.

Abstract: A semiconductor package including a universal substrate with interior pads, peripheral pads, and substrate traces positioned between the interior pads and the peripheral pads. The interior pads are configured for electrical interface with a first semiconductor chip. The peripheral pads are configured for electrical interface with a second semiconductor chip that is larger than the first semiconductor chip. By providing a universal substrate that can accommodate multiple die sizes, package design time and costs can thus be reduced.

Abstract: A potato seed planter includes one or more planting units with an endless conveyor. A plurality of cups are attached to the conveyor and each cup receives a potato seed as the conveyer travels upwardly between upper and lower sprockets. As the cups pass around the upper sprocket, any extra seeds in cups are removed by centrifugal force, differential velocity and/or a vibration unit. These extra potato seeds are recycled and returned to the seed bowl. The cups then travel through a generally horizontal singulation section and around a third sprocket. The cups are inverted as they pass around the third sprocket and the seeds fall onto the back surface of the next forwardly adjacent cup. A guide structure holds the seeds in the desired position until they reach a discharge area where the individual seeds are discharged into the furrow.

Abstract: A hydrophilic crosslinkable copolymer comprising monomer units derived from an ester of an ethylenically unsaturated carboxylic acid wherein the ester group contains a labile primary hydroxyl group and monomer units derived from a halohydroxyalkyl ester of an ethylenically unsaturated carboxylic acid is disclosed. The copolymer is useful in affinity separation systems.

Abstract: A method and apparatus for transferring articles, such as pails, from a first station to a second station so that the articles may be loaded at the second station in a preselected spaced-saving array includes a transfer carriage operable for selective shifting along a path between the first and second stations and a gripping device utilizing clamps mounted on the transfer carriage operable for selectively gripping and releasing the articles. An orienting device is operatively associated with the gripping device and is operable for selectively imparting rotation thereto so that the articles may be loaded in a nested array.