Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: A curable coating composition that may be converted to a cured coating for an optical fiber during a continuous fiber coating process. The curable coating composition comprises an organohydrogenpolysiloxane, an alkenyl functional polysiloxane, and an ultraviolet radiation absorbing hydrosilation photocatalyst in an amount for crosslink formation between the organohydrogenpolysiloxane and the alkenyl functional polysiloxane. The curable coating composition crosslinks under the influence of ultraviolet radiation to provide a cured coating having a high level of transparency to ultraviolet radiation. Application of heat to the curable coating composition accelerates the rate of cured coating formation. The high level of transparency of the cured coating allows from about 70% to about 99% of radiation of wavelengths from about 240 nm to about 275 nm to pass through the coating for writing a refractive index grating to produce an optical fiber Bragg grating .

Abstract: Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and two metal-containing catalysts. One catalyst may be activated by actinic radiation, and the second by heat but not the actinic radiation. Polymerization of the photopolymerizable composition to form the encapsulant may be carried out by selectively activating the different catalysts. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant.

Abstract: A method of making a light emitting device is disclosed herein, the method including the steps of (A) providing a light emitting diode; and (B) contacting the light emitting diode with a photopolymerizable composition comprising: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation; a first metal-containing catalyst that may be activated by actinic radiation; and a second metal-containing catalyst that may be activated by heat but not the actinic radiation; and (C) heating the photopolymerizable composition to a temperature of less than 150° C. to initiate hydrosilylation, thereby forming a first encapsulant.

Abstract: Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and a metal-containing catalyst that may be activated by actinic radiation. Photopolymerization of the photopolymerizable composition is then carried out to form the encapsulant. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant.

Abstract: A method of making a light emitting device is disclosed herein. The method includes the steps of: (A) providing a light emitting diode; and (B) contacting the light emitting diode with a photopolymerizable composition having: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation; a first metal-containing catalyst that may be activated by actinic radiation; and a second metal-containing catalyst that may be activated by heat but not the actinic radiation. The method may further include the step of: (C) applying actinic radiation of 700 nm or less to initiate hydrosilylation within the silicon-containing resin. The method may also include the step of: (D) heating the photopolymerizable composition to less than 150° C. to further initiate hydrosilylation, or (D) simultaneously applying actinic radiation and heat.

Abstract: A chromonic nanoparticle mixture prepared by combining (i) a continuous water-soluble polymer phase and (ii) a discontinuous chromonic phase comprising a chromonic material; and non-covalently crosslinking the resulting chromonic nanoparticles with a polyvalent cation salt.

Abstract: A chrmonic nanoparticle mixture prepared by combining (i) a continuous water-soluble polymer phase and (ii) a discontinuous chromonic phase comprising a chromonic material; and non-covalently crosslinking the resulting chromonic nanoparticles with a polyvalent cation salt.

Abstract: A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin, a metal-containing catalyst, and surface treated particles, the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation, the surface treated particles comprising nonabsorbing metal oxide particles, semiconductor particles, or combinations thereof, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: An LED package includes an LED die and a light-transmissive material encapsulating the die. The encapsulant is formed by dispensing a curable material onto a substrate, such as a carrier on which is mounted the LED die, to form a liquid mass thereon, the liquid mass having an unconstrained smooth outer surface. The dispensed material is then cured to convert the liquid mass to a solid encapsulant having an outer encapsulant surface, the curing being performed under conditions to provide the outer encapsulant surface with undulating surface features. The encapsulant can alternatively be formed on a release liner or other film and after curing be affixed to an LED, such as an LED die, an LED die mounted to another substrate, or an LED die mounted to another substrate and encapsulated initially in another light transmissive material.

Abstract: A method of making a light emitting device is disclosed. The method includes the steps of providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: Methods for making encapsulated light emitting diodes, and light emitting articles prepared thereby are disclosed. The methods include activating a light emitting diode to emit light to at least partially polymerize a photopolymerizable encapsulant.

Abstract: A hydrophilic polymer composition is described comprising thermoplastic of thermoset polymer, and a fluorochemical additive dispersed therein. The hydrophilic composition is useful, for example, in medical and surgical drapes.

Abstract: Provided is an organic thin film transistor comprising a polymeric layer interposed between a gate dielectric and an organic semiconductor layer. Various homopolymers, copolymers, and functional copolymers are taught for use in the polymeric layer. An integrated circuit comprising a multiplicity of thin film transistors and methods of making a thin film transistor are also provided. The organic thin film transistors of the invention typically exhibit improvement in one or more transistor properties.

Abstract: Provided is an organic thin film transistor comprising a polymeric layer interposed between a gate dielectric and an organic semiconductor layer. Various homopolymers, copolymers, and functional copolymers are taught for use in the polymeric layer. An integrated circuit comprising a multiplicity of thin film transistors and methods of making a thin film transistor are also provided. The organic thin film transistors of the invention typically exhibit improvement in one or more transistor properties.