Abstract: An electromagnetic interference (EMI) shielding vent panel according to one embodiment generally includes an electrically-conductive porous substrate. The electrically-conductive porous substrate may include electrically-conductive reticulated or open-celled polymeric foam having a plurality of pores in a substantially nonuniform configuration. The vent panel may also include electrically-conductive wire mesh adjacent at least a portion of the electrically-conductive porous substrate for increasing shielding effectiveness.

Abstract: An electromagnetic interference shield generally includes a resilient core member and an electrically conductive layer. An adhesive bonds the electrically conductive layer to the resilient core member. The adhesive can include halogen-free flame retardant. The electrically conductive layer can be provided with halogen-free flame retardant and/or a corrosion inhibitor.

Abstract: Flame retardant EMI shielding materials with improved retention of shielding properties are disclosed. The shielding materials are provided with a dispersed flame retardant on the surfaces of the internal interstices. Methods of making the flame retardant shielding materials are also disclosed.

Abstract: Flame retardant EMI shielding materials with improved retention of shielding properties are disclosed. The shielding materials are provided with a dispersed flame retardant on the surfaces of the internal interstices. Methods of making the flame retardant shielding materials are also disclosed.

Abstract: Flame retardant EMI shielding materials with improved retention of shielding properties are disclosed. The shielding materials are provided with a dispersed flame retardant on the surfaces of the internal interstices. Methods of making the flame retardant shielding materials are also disclosed.

Abstract: Provided are methods of preparing an electrically conductive foam. The methods include the following steps: (a) providing a foam substrate comprising a foam layer and a fabric layer; (b) contacting the foam substrate with a sensitizing solution; (c) contacting the foam substrate with an activation solution; and (d) forming a metallic layer on the foam substrate with an electroless plating process. Also provided are electrically conductive foams formed by such methods. The present methods and foams have particular applicability to the manufacture of computer-related shielding devices.

Abstract: Disclosed are methods for manufacturing electromagnetic interference shields for use around access panels and doors in electronic equipment enclosures and elsewhere. The shields may include an electrically nonconductive substrate in combination with an electrically conductive element. In one embodiment, the method may use vapor deposition, plating, or painting techniques for depositing a conductive layer on the substrate surface. In another embodiment the method may use foam-forming to intersperse conductive elements within the substrate. The conductive layer and conductive elements provide effective shielding and grounding functions, and the substrate provides elastic compliancy and resiliency to the shield.