Abstract: Several embodiments of microelectronic imager packages with covers having non-planar surface features are disclosed herein. One embodiment is directed to a imager package that includes an imager die having a plurality of photo sensors and an enclosure substantially enclosing the imager die. The enclosure has a cover attached to a base with an adhesive. The cover has a transparent central portion superimposed with the photo sensors and a peripheral portion around the central portion. The cover has a non-planar portion in the peripheral portion, and the non-planar portion is configured to increase a bonding strength between the cover and the base.