Abstract: Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes.

Abstract: A method for manufacturing a cured resin impregnated substrate comprising placing a substrate into a impregnation zone including a solvent containing curable resin to produce a resin impregnated substrate and at least partially curing the resin impregnated substrate to produce a cured resin impregnated substrate, wherein the number of voids in the cured resin impregnated substrate are reduced by processing the substrate in at least one processing step that reduces the number of voids in the cured resin impregnated substrate product.

Abstract: A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxides in combination with the dicyandiamide, a reactivity controller for the imidazole to reduce the curing speed, and a solvent. The use of undesirable solvents such as DMF is reduced. A glass transition temperature greater than 135.degree. C. is obtained in the cured composition and is maximized by balancing the amounts of dicyandiamide, the imidazole, and the reactivity controller.

Abstract: Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate first with a solution of a catalytic metal and then with an electroless copper plating solution.

Abstract: Columns, walls and other solid structures of concrete, wood, masonry or other materials are non-destructively tested by acoustic signals transmitted from a carriage. The carriage has a frame which is wheel mounted to move over the surface of the test candidate. An internally-mounted piezoelectric crystal roller as an acoustic signal generator or receiver is suspended from the carriage with two degrees of spring freedom to allow accommodation of irregularities in the test candidate surface. The assembly including the piezoelectric crystal roller and its flexible mounting are configured as a replaceable module relative to the carriage frame. The same carriage is useable as an echo type acoustic scanner or, in combination with other devices or carriages, as either an acoustic transmitter or receiver although inclusion of elements to perform both functions within the same carriage is contemplated.

Abstract: A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a reactive brominated aromatic compound, particularly a member of the group consisting of group consisting of tribromophenyl maleimide, tribromostyrene, and pentabromobenzyl acrylate; and(c) a multifunctional nitrogen compound, particularly dicyandiamide, and optionally(d) ethylene bistetrabromophthalimide.

Abstract: Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.

Abstract: A laminate which has improved dimensional stability may be prepared by impregnating a reinforcing substrate such as a woven glass cloth with an epoxy resin system having a relatively high molecular weight, in excess of about 850, in the presence of a curing agent followed by curing, pressing and post-baking substrate to form the desired laminate board. The variation in this dimensional stability can also be improved by utilizing a B-stage substrate which has been cured to a lower flow percentage.

Abstract: A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol). Flame retardance is improved by the addition of octabromodiphenyl oxide.

Abstract: A thermosetting resin is comprised of (a) a bisimide, particularly a bismaleimide, (b) a polyphenol, particularly a bisphenol, and (c) dicyandiamide. The polyphenol may be styrene-terminated (i.e. a vinyl benzyl ether of a bisphenol).

Abstract: Multilayer laminates and substrates for carriers of silicon chips which are used in circuitry boards will comprise woven hybrid glass cloth formed from fiberglass and a second material which possesses a coefficient of thermal expansion of less than about 5.0.times.10.sup.-6 in/in/.degree.C. The resulting laminates will be thermally and dimensionally stable. As an example, a hybrid glass cloth may be formed in which the warp yarn of said cloth is fiberglass and the fill yarn is boron nitride. The resulting cloth may be used to form laminates which possess a coefficient of thermal expansion similar in nature to that of a chip carrier such as ceramic, thus minimizing the danger of a solder fracture.

Abstract: Woven hybrid glass cloths which may be utilized as chip carrier substrates and as inner layers in multi-layer laminate circuit boards which will be stable due to a desired co-efficient of thermal expansion may be prepared by weaving fiberglass with a second material which possesses a co-efficient of thermal expansion of less than 5.0.times.10.sup.-6 inch/inch/.degree.C. The mixture of fiberglass in this material may be used as a warp and a fill yarn. The thus woven cloth will possess a dimensional stability suitable for use in preparing multi-layer materials and for use in direct mounting ceramic chip carriers to this chip carrier substrate. Examples of materials which possess a co-efficient of thermal expansion of less than the desired number will include nylon filaments, ceramics, boron nitrite filaments, etc.