Abstract: According to one exemplary embodiment, a structure comprises a laminate substrate having a top surface for receiving a semiconductor die. The structure further comprises an antenna element situated on the top surface of the laminate substrate, where the antenna element is coupled to a laminate substrate bond pad. For example, the antenna element may also be coupled to the laminate substrate bond pad by a trace on the top surface of the laminate substrate. According to this exemplary embodiment, the structure further comprises a bonding wire that provides an electrical connection between the laminate substrate bond pad and a semiconductor die bond pad. For example, the input impedance of the antenna element coupled to the laminate substrate bond pad may match the output impedance at the semiconductor die bond pad. The structure may further comprise a capacitor coupled to the antenna element.

Abstract: One exemplary embodiment is a structure comprising a laminate substrate having a top surface for receiving a semiconductor die. The exemplary structure further comprises an antenna element situated on a bottom surface of the laminate substrate, where the antenna element is suitable for connection to the semiconductor die. According to this exemplary embodiment, the structure further comprises a laminate substrate reference pad in the laminate substrate, where the laminate substrate reference pad is situated over the antenna element. The exemplary structure further comprises at least one laminate substrate reference via situated at a side of the antenna element. The at least one laminate substrate reference via can be electrically connected to the laminate substrate reference pad. The at least one laminate substrate reference via can be electrically coupled to a printed circuit board reference via in a printed circuit board.

Abstract: A global positioning system (GPS) receiver and high accuracy low power time source (HAL) are disclosed. The HAL provides a time source having an accuracy which is high enough for the receiver to achieve fast direct Y-code acquisition. The HAL includes an oscillator adapted to provide an uncompensated frequency signal at a desired frequency. Frequency conversion circuitry receives the uncompensated frequency signal and a control signal as inputs, and provides as an output a compensated frequency signal having an average compensated frequency which is closer to the desired frequency than is the average uncompensated frequency. A temperature sensor provides an output indicative of a temperature of the oscillator. Frequency error determining circuitry determines an error value, as a function of the temperature sensor output, which is indicative of a quantity of frequency error over time in the uncompensated frequency signal.