Abstract: A device that determines conditions under which a book cover and page delamination is more likely to occur in a binder subassembly line of a book binding system collects and stores data pertaining to numerous bindery process variables such as, temperatures of a glue pot assembly, temperatures of a gas burner assembly, ambient temperatures and humidity of the air surrounding the binder subassembly line, viscosity values for an emulsion glue, and moisture content measurements of the emulsion glue after application of the emulsion glue to a backbone of a book. The device then implements a correlation analysis using the stored data to determine if there is a correlation between data and the occurrence of a delamination, and produces an optimal value or range for operation of the book binding system.