Patents by Inventor Larry Edward Moser

Larry Edward Moser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board having inductive vias
    Publication number: 20040160721
    Abstract: A printed circuit board includes at least one via providing a conductive path through the printed circuit board. The via comprises at least one axially extending conductive strip formed by cutting material from a metal barrel lining the interior wall of the via.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Inventors: Alexander W. Barr, Samuel C. Ramey, Larry Edward Moser
  • Method of making printed circuit board having inductive vias
    Patent number: 6711814
    Abstract: A method for increasing the impedance of a via for providing a conductive path through a printed circuit board is disclosed. The method comprises the steps of forming a conductive pad on the printed circuit board, forming a non-threaded opening extending through the conductive pad and through the printed circuit board to form an annular conductive pad surrounding the non-threaded opening, forming a conductive metal barrel lining the inner wall of the non-threaded opening connected to the annular conductive pad, and cutting material from the metal barrel to leave at least one conductive strip extending axially along the inner wall of the opening without cutting material from the annular conductive pad so that the at least one conductive strip is connected to an undivided annular conductive pad.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: March 30, 2004
    Assignee: Robinson Nugent, Inc.
    Inventors: Alexander W. Barr, Samuel C. Ramey, Larry Edward Moser
  • Printed circuit board having inductive vias
    Publication number: 20020022110
    Abstract: A printed circuit board includes at least one via providing a conductive path through the printed circuit board. The via comprises at least one axially extending conductive strip fonned by cutting material from a metal barrel lining the interior wall of the via.
    Type: Application
    Filed: June 18, 2001
    Publication date: February 21, 2002
    Inventors: Alexander W. Barr, Samuel C. Ramey, Larry Edward Moser