Abstract: A solid ink printer includes a melt plate configured to melt solid ink. A heater is connected to the melt plate in order to raise the temperature of the melt plate. The temperature of the melt plate is detected by a temperature sensor that is provided away from the surface of the melt plate but is configured to sense the temperature of the melt plate. A mount is positioned on the melt plate between the temperature sensor and the melt plate. The mount includes a mica layer and at least one polyimide film layer. The mount is arranged on the melt plate such that the mica layer of the mount may be adjacent to the melt plate and the polyimide film layer may be adjacent to the temperature sensor. A pressure sensitive adhesive may be used to connect the mount to the melt plate.

Abstract: A maintenance system and method for maintaining an imaging member of an imaging device includes a pre-cleaning device to clean the imaging member; an applicator to apply release agent to the imaging member; a metering device to meter release agent on the imaging member; a reservoir to remotely store release agent; and a pump to supply the applicator with release agent from the reservoir. The saturation level of the applicator is monitored and maintained within a predetermined range. The applicator, pre-cleaning device and metering device may be independently actuated to engage the imaging member. Release agent collected by the pre-cleaning device and/or metering device may be recycled. Debris collected by the pre-cleaning device and/or metering device may be stored and/or removed.

Abstract: A solid ink printer comprises a melt plate configured to melt solid ink. A heater is connected to the melt plate in order to raise the temperature of the melt plate. The temperature of the melt plate is detected by a temperature sensor that is provided away from the surface of the melt plate but is configured to sense the temperature of the melt plate. A mount is positioned on the melt plate between the temperature sensor and the melt plate. The mount comprises a mica layer and at least one polyimide film layer. The mount is arranged on the melt plate such that the mica layer of the mount may be adjacent to the melt plate and the polyimide film layer may be adjacent to the temperature sensor. A pressure sensitive adhesive may be used to connect the mount to the melt plate.