Patents by Inventor Larry Flannery

Larry Flannery has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for reducing the metal content in the device layer of SOI structures and SOI structures produced by such methods
    Patent number: 8796116
    Abstract: Methods for producing silicon on insulator structures with a reduced metal content in the device layer thereof are disclosed. Silicon on insulator structures with a reduced metal content are also disclosed.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: August 5, 2014
    Assignee: SunEdison Semiconductor Limited
    Inventors: Alexis Grabbe, Larry Flannery
  • METHODS FOR REDUCING THE METAL CONTENT IN THE DEVICE LAYER OF SOI STRUCTURES AND SOI STRUCTURES PRODUCED BY SUCH METHODS
    Publication number: 20120193753
    Abstract: Methods for producing silicon on insulator structures with a reduced metal content in the device layer thereof are disclosed. Silicon on insulator structures with a reduced metal content are also disclosed.
    Type: Application
    Filed: January 20, 2012
    Publication date: August 2, 2012
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Alexis Grabbe, Larry Flannery
  • Dressing a wafer polishing pad
    Patent number: 7846006
    Abstract: A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: December 7, 2010
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • System and method for dressing a wafer polishing pad
    Patent number: 7846007
    Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: December 7, 2010
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • SYSTEM AND METHOD FOR DRESSING A WAFER POLISHING PAD
    Publication number: 20090176441
    Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
    Type: Application
    Filed: January 9, 2009
    Publication date: July 9, 2009
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • Dressing a Wafer Polishing Pad
    Publication number: 20080009231
    Abstract: A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 10, 2008
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Mark Stinson, Madhavan Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Rinaldi, Larry Flannery