Abstract: A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time. A resistive layer is formed on the dielectric layer after the dielectric tape is laminated to the substrate. A protective layer is formed over the resistive layer.

Abstract: A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time. A resistive layer is formed on the dielectric layer after the dielectric tape is laminated to the substrate. A protective layer is formed over the resistive layer.

Abstract: A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is farmed on the dielectric layer, and a protective layer is formed over the resistive layer.

Abstract: A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

Abstract: An apparatus for positioning a tape preform as a layer onto a substrate during the manufacture of a layered resistive device is provided. The apparatus includes at least one positioning member, wherein the positioning member defines a proximal end portion and a distal end portion. The apparatus also includes a contact member adapted to engage the tape preform against the substrate. The contact member and the distal end portion of the positioning member are configured to position the tape preform onto the substrate.

Abstract: A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

Abstract: An apparatus for positioning a tape preform as a layer onto a substrate during the manufacture of a layered resistive device is provided. The apparatus includes at least one positioning member, wherein the positioning member defines a proximal end portion and a distal end portion. The apparatus also includes a contact member adapted to engage the tape preform against the substrate. The contact member and the distal end portion of the positioning member are configured to position the tape preform onto the substrate.

Abstract: A process of forming a resistive device such as s load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is farmed on the dielectric layer, and a protective layer is formed over the resistive layer.