Patents by Inventor Larry Frisa

Larry Frisa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photomask and method for conveying information associated with a photomask substrate
    Publication number: 20060269851
    Abstract: A method for conveying information about a photomask substrate is disclosed. The method includes heating an area of a photomask substrate located between a top surface and a bottom surface of the photomask substrate with a laser. The heat applied to the area of the substrate forms a mark inside the substrate that stores information identifying the photomask substrate.
    Type: Application
    Filed: August 7, 2006
    Publication date: November 30, 2006
    Inventors: Larry Frisa, Franklin Kalk
  • Method and system for determining a thickness of a layer
    Patent number: 6671059
    Abstract: The present invention relates to a method of determining a thickness of at least one layer on at least one semiconductor wafer (12), comprising the steps of: projecting a first laser pulse (14) on a surface (16) of the at least one layer (10), thereby generating an acoustical wave due to heating of the surface of the at least one layer (10); after a propagation time of the acoustical wave, projecting a series of second laser pulses (18) on the surface (16) of the at least one layer (10); measuring reflected laser pulses (20) of the second laser pulses (18), thereby sensing the times of reflection property changes of the surface (16) of the at least one layer (10); and determining the thickness of the at least one layer (10) by analyzing the times of reflection property changes. The present invention further relates to a system for determining a thickness of a layer (10) on a semiconductor wafer (12).
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: December 30, 2003
    Assignee: Motorola, Inc.
    Inventors: Larry Frisa, Karl Mautz
  • Method and system for determining a thickness of a layer
    Publication number: 20030082840
    Abstract: The present invention relates to a method of determining a thickness of at least one layer on at least one semiconductor wafer (12), comprising the steps of: projecting a first laser pulse (14) on a surface (16) of the at least one layer (10), thereby generating an acoustical wave due to heating of the surface of the at least one layer (10); after a propagation time of the acoustical wave, projecting a series of second laser pulses (18) on the surface (16) of the at least one layer (10); measuring reflected laser pulses (20) of the second laser pulses (18), thereby sensing the times of reflection property changes of the surface (16) of the at least one layer (10); and determining the thickness of the at least one layer (10) by analyzing the times of reflection property changes. The present invention further relates to a system for determining a thickness of a layer (10) on a semiconductor wafer (12).
    Type: Application
    Filed: September 13, 2002
    Publication date: May 1, 2003
    Inventors: Larry Frisa, Karl Mautz
  • Method and system for determining a thickness of a layer
    Patent number: 6472237
    Abstract: The present invention relates to a method of determining a thickness of at least one layer on at least one semiconductor wafer (12), comprising the steps of: projecting a first laser pulse (14) on a surface (16) of the at least one layer (10), thereby generating an acoustical wave due to heating of the surface of the at least one layer (10); after a propagation time of the acoustical wave, projecting a series of second laser pulses (18) on the surface (16) of the at least one layer (10); measuring reflected laser pulses (20) of the second laser pulses (18), thereby sensing the times of reflection property changes of the surface (16) of the at least one layer (10); and determining the thickness of the at least one layer (10) by analyzing the times of reflection property changes. The present invention further relates to a system for determining a thickness of a layer (10) on a semiconductor wafer (12).
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: October 29, 2002
    Assignee: Motorola, Inc.
    Inventors: Larry Frisa, Karl Mautz