Abstract: Semi-rigid heat transfer devices are provided for heating or cooling components, such as electrical components, wherein the heat transfer devices are sufficiently flexible to conform to the shapes of the components, but are sufficiently rigid to maintain its overall structual shape. Moreover, the heat transfer devices include at least a frame or support portion thereof and a layer of flexible film. The frame and film layer are advantageously heat sealable according to one aspect of the present invention. The degree of flexibility for a particular heat transfer device can be designed in accordance with the specific requirements of particular applications.