Abstract: A process for step etching a metal tape adapted for use in tape automated bonding comprises forming an etch resist pattern on the tape having a first portion defining a pattern of leads and a second portion within the first portion defining steps in the leads. The metal tape is etched in the regions not covered by the resist at a desired rate and etched in the regions for forming the step at a reduced rate as compared to the desired rate, thereby forming the tape having a plurality of leads corresponding to the resist pattern with each of the leads having a step therein generated by the second portion of the resist pattern. The metal tape formed by the process has a unique structure wherein the web between bumps formed at the end of the leads and the remainder of the leads has a unique channel beam cross section for stiffening the web which is relatively thin as compared to the leads or the bump.

Abstract: A testable tape for forming electrical innerlead connections between conductive pads, such as in semiconductor die, and a process for manufacturing the testable tape are disclosed. The testable tape includes a plurality of leads arranged in a pattern to form the innerlead bonds to the die. The plurality of leads is supported with a dielectric fill formed selectively on the lead pattern to support and electrically isolate the leads for testing.