Abstract: A method of increasing the wafer yield for an integrated circuit includes the steps of receiving as input a shot map, an initial orientation of a center of the shot map relative to a center of a wafer resulting in a maximum number of printable die, a usable wafer diameter, a selected yield margin, and historical yield information for each die location in the shot map; generating a plot of an estimated yield for each die location in the wafer from the historical yield information; plotting an estimated wafer yield within an area of the wafer as a function of a radius; and selecting a sweet spot radius corresponding to an area of the wafer having a wafer yield that is substantially equal to the selected yield margin for finding an offset from the initial orientation of the center of the shot map that results in a maximum wafer yield.

Abstract: A method of increasing the wafer yield for an integrated circuit includes the steps of receiving as input a shot map, an initial orientation of a center of the shot map relative to a center of a wafer resulting in a maximum number of printable die, a usable wafer diameter, a selected yield margin, and historical yield information for each die location in the shot map; generating a plot of an estimated yield for each die location in the wafer from the historical yield information; plotting an estimated wafer yield within an area of the wafer as a function of a radius; and selecting a sweet spot radius corresponding to an area of the wafer having a wafer yield that is substantially equal to the selected yield margin for finding an offset from the initial orientation of the center of the shot map that results in a maximum wafer yield.

Abstract: A motion transmitting remote control assembly (10) includes a core terminal (20) composed of a slider (26) and a sleeve (46). Flexible cantilever fingers (48) extend from the sleeve (46) and are inserted into an aperture (22) in the top of an accelerator pedal (16). A compression spring (64) is disposed between the sleeve (46) and the slider (26) for providing over travel protection. Splines (42) are positioned along the slider (26) to support the sleeve (46) as it slides thereover during operation. The improvement of this invention resides in distal tips (50) of the fingers (48) which angle into a protective position seated behind the end stop flange (34) of the slider (26). This arrangement allows the end stop flange (34) to center the terminal (20) as it is pushed through the aperture (22) in the accelerator pedal (16), instead of using the fingers (48) to center the terminal (20), thereby reducing the potential for misalignment or incomplete connection.