Abstract: Modular power supply apparatus wherein a plurality of d.c.-to-d.c. converters are coupled to an internally structured heat exchange channel through which fan driven air is passed in an unobstructed manner along a flow axis. Each of the converter modules is combined with a dedicated module circuit board which provides regulated output terminals in an orientation or direction arranged transversely to the flow axis. The opposite end of the module circuit boards are plugged into a main interconnect circuit board positioned along one side of the heat exchange channel. A support channel is provided outwardly of the main interconnect circuit board within which principal components of supporting circuitry are contained.

Abstract: A power supply/backplane assembly and system wherein a substantially flat power supply assembly including a printed circuit, power converter modules, and heat sink is mounted directly to the rearwardly disposed surface of a backplane. The size of the power supply and the region at which it is mounted substantially falls within the border of a fully defined region of the backplane. Flat copper traces carried by the power supply circuit board function to carry regulated power directly to the backplane via a power bolt system. Thus, conventional cabling is eliminated. The circuit board also is employed in conjunction with readily accessible connector components to provide for simplified wiring installation of support features such as the interaction between a supervisory panel and a front end a.c.-to-d.c. conversion component.

Abstract: Bus-based computer system circuit modules are developed and tested in a desk-top apparatus including a base supported for select tilting upon a cradle. The base, in turn, supports a backplane support assembly which, in turn, supports a top assembly to define a card cage having open sides. A backplane into which the circuit modules may be plugged is supported by the backplane assembly, and access to the active components of the circuit modules is provided through the open sides. The rearward face of the backplane is made accessible for wire wrapping procedures and the like by mounting the power supply for the apparatus below the backplane and providing for the tilting of the assemblage downwardly and forwardly to improve rearward face access. Both voltage and current are monitored at the backplane and the values of these parameters are displayed at digital meters mounted upon the top assembly. The latter, current monitoring is carried out using closed loop Hall effect sensors.

Abstract: An enclosure is provided for circuit modules which are mounted as an array in a vertical orientation within a card cage and which are electrically coupled to a back plane positioned rearwardly within the housing. A plurality of specified voltages asserted from a primary power source within the housing are monitored by a microcomputer based control system performing in conjunction with programmable memory. The status of the voltage sources is displayed at a supervisory panel mounted at the front face of the enclosure. This supervisory panel includes an array of light emitting diode based indicators which display both acceptable performance and out of tolerance performance to the operator. The outputs for each channel additionally are associated with a reset switch permitting a form of operator interrogation of any channel in question. The heat transfer air path of the enclosure is initiated along the sides of the enclosure where conveniently accessible elongate and vertically oriented filters are positioned.