Abstract: In one embodiment, an apparatus for reducing deflection of a mobile member in a chamber includes at least one receiver projecting from a base member in the chamber and at least one engager projecting from the mobile member. Each engager is matable with a receiver when the mobile member is inserted into the chamber. When at least one retractable mechanism disposed in the chamber engages the mobile member or at least one device carried thereon, each engager engages a receiver, reducing deflection of the mobile member.

Abstract: A reusable carrier 10 for temporarily holding an integrated circuit 12 during burn-in and electrical test includes a base 14 and a lid 16 attached to the base 14 by hinges 18. A flexible substrate 19 is attached to the base 14. Alignment posts 20 have tapered surfaces 22 that engage corners 24 of the integrated circuit 12 to position the integrated circuit 12 precisely on upper surface 26 of the substrate 19. A spring-loaded latch 28 engages projection 30 in aperture 32 of the base 14 to hold the lid 16 closed over the integrated circuit 12. Electrically conductive traces 34 on the surface 26 have contact bumps which engage contact pads on the underside of the integrated circuit 12 to connect the integrated circuit 12 to peripheral contact pads 38 around edges 40 of the substrate 19.

Abstract: A reusable carrier (10) for temporarily holding an integrated circuit (12) during burn-in and electrical test includes a base (14) and a lid (16) attached to the base (14) by hinges (18). A flexible substrate (19) is attached to the base (14) with a suitable adhesive. Alignment posts (20) have tapered surfaces (22) that engage corners (24) of the integrated circuit (12) to position the integrated circuit (12) precisely on upper surface (26) of the substrate (19). A spring-loaded latch (28) engages projection (30) in aperture (32) of the base (14) to hold the lid (16) closed over the integrated circuit (12). Electrically conductive traces (34) on the surface (26) have contact bumps which engage contact pads on the underside of the circuit (12) to connect the integrated circuit (12) to peripheral contact pads (38) around edges (40) of the substrate (19).