Patents by Inventor Larry Morrell

Larry Morrell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Etch before grind for semiconductor die singulation
    Patent number: 7482251
    Abstract: Methods are provided, and devices made by such methods. One of the methods includes procuring a semiconductor wafer, processing the wafer to form a plurality of circuits on a top side, forming trenches on the top side between the adjacent circuits, forming a trench passivation layer on side walls of the trenches, forming conductive bumps on the top side of the wafer; and removing material from the bottom side to thin the wafer, and eventually separate the wafer along the trenches into dies, where each die includes only one of the circuits.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: January 27, 2009
    Assignee: Impinj, Inc.
    Inventors: Ronald E Paulsen, Ronald L. Koepp, Yanjun Ma, Larry Morrell, Andrew E. Horch