Patents by Inventor Larry R. Bersuch

Larry R. Bersuch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7198692
    Abstract: A method is provided for using a three-dimensional, Pi-shaped, woven preform to assemble first and second composite components. The preform is infused with resin, and at least one surface of the preform is adhered to at least one surface of the first component using a film adhesive. The preform is cured while an oversized tool coated with non-stick material is located within a clevis formed by two legs of the preform. A removable peel ply is located between the tool and the clevis, and semi-rigid over-presses are used during curing. After curing, the tool, over-presses, and peel ply are removed, and adhesive is injected into the clevis. The second component is inserted into the clevis, the adhesive adhering to an inner surface of the clevis and to at least one surface of the second component for retaining the second component within the clevis, the second component having a smaller width than the tool.
    Type: Grant
    Filed: February 14, 2005
    Date of Patent: April 3, 2007
    Assignee: Lockheed Martin Corporation
    Inventors: Larry R. Bersuch, Dan V. Heap, Ross A. Benson
  • Patent number: 6911175
    Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: June 28, 2005
    Assignee: Lockheed Martin Corporation
    Inventors: Ross A. Benson, Larry R. Bersuch, Harry R. Miller, Ronald P. Schmidt, Linas Repecka
  • Patent number: 6863767
    Abstract: A method is provided for using a three-dimensional, Pi-shaped, woven preform to assemble first and second composite components. The preform is infused with resin, and at least one surface of the preform is adhered to at least one surface of the first component using a film adhesive. The preform is cured while an oversized tool coated with non-stick material is located within a clevis formed by two legs of the preform. A removable peel ply is located between the tool and the clevis, and semi-rigid over-presses are used during curing. After curing, the tool, over-presses, and peel ply are removed, and adhesive is injected into the clevis. The second component is inserted into the clevis, the adhesive adhering to an inner surface of the clevis and to at least one surface of the second component for retaining the second component within the clevis, the second component having a smaller width than the tool.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: March 8, 2005
    Assignee: Lockheed Martin Corporation
    Inventors: Larry R. Bersuch, Dan V. Heap, Ross A. Benson
  • Patent number: 6821368
    Abstract: A method is provided for using a woven preform having a base and at least one leg extending from the base. The preform is used to assemble first and second composite laminate components formed from tape or fabric and a resin matrix. Z-pins are inserted into the first component prior to its being cured, forming a stubble extending above a surface of the first component. The uncured preform is placed on the surface of the first component, the stubble extending into the preform. The cured second component is attached to the preform. Over-wrap plies are optionally placed on the outer surfaces of preform. Adhesive is optionally placed between the preform and the first and second components. A vacuum bag and tooling are used while curing the preform to adhere the legs of the preform to the second component and the base of the preform to the first component.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: November 23, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Ross A. Benson, Patrick D. Sheahen, Larry R. Bersuch
  • Publication number: 20040104516
    Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.
    Type: Application
    Filed: November 12, 2003
    Publication date: June 3, 2004
    Applicant: Lockheed Martin Corporation
    Inventors: Ross A. Benson, Larry R. Bersuch, Harry R. Miller, Ronald P. Schmidt, Linas Repecka
  • Patent number: 6712099
    Abstract: A three-dimensional weave architecture for weaving preforms has fill fibers woven to provide layer-to-layer interlocking of layers of warp fiber as well as interlocking of fibers within each layer. The woven preform transfers out-of-plane loading through directed fibers to minimize inter-laminar tension. The preform has a base and at least one leg extending from the base, the base and leg each having at least two layers of warp fibers. The fill fibers follow a weave sequence which carries them through part of the base, then into the legs, then through the other portion of the base, and back through the base to return to the starting point of the fill tow. The leg may be connected at a single- or distributed-column intersection, and the intersection may be radiussed. The outer ends of the base and legs may have tapers formed from terminating layers of warp fibers in a stepped pattern.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: March 30, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Ronald P. Schmidt, Larry R. Bersuch, Ross A. Benson, Amir Islam
  • Publication number: 20040023581
    Abstract: A method uses a three-dimensional, adhesive-infused, woven preform to assemble two components, each component having z-pins extending from bonding surfaces. The components and preform are assembled with surfaces of the preform contacting surfaces of the components, the z-pins penetrating into the preform. The adhesive in the preform is then cured, adhering the preform to the components and retaining the z-pins within the preform. The adhesive may be cured at room temperature or through heat applied to the outer component. Alternatively, an electron-beam may be used to cure the adhesive. Use of z-pins in the bond area and an adhesive, instead of a resin, creates a stronger joint, especially with fiber-reinforcement of the adhesive. The thickness of the compressible, three-dimensional weave provides for a larger dimensional tolerance at each bond line.
    Type: Application
    Filed: August 5, 2002
    Publication date: February 5, 2004
    Inventors: Larry R. Bersuch, Patrick D. Sheahen
  • Patent number: 6676882
    Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: January 13, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Ross A. Benson, Larry R. Bersuch, Harry R. Miller, Ronald P. Schmidt, Linas Repecka
  • Publication number: 20030066589
    Abstract: A method is provided for using a woven preform having a base and at least one leg extending from the base. The preform is used to assemble first and second composite laminate components formed from tape or fabric and a resin matrix. Z-pins are inserted into the first component prior to its being cured, forming a stubble extending above a surface of the first component. The uncured preform is placed on the surface of the first component, the stubble extending into the preform. The cured second component is attached to the preform. Over-wrap plies are optionally placed on the outer surfaces of preform. Adhesive is optionally placed between the preform and the first and second components. A vacuum bag and tooling are used while curing the preform to adhere the legs of the preform to the second component and the base of the preform to the first component.
    Type: Application
    Filed: October 9, 2001
    Publication date: April 10, 2003
    Inventors: Ross A. Benson, Patrick D. Sheahen, Larry R. Bersuch
  • Publication number: 20030041948
    Abstract: A method is provided for securing a three-dimensional woven preform to a first composite laminate component, the preform having a base and at least one leg extending from the base. The preform may be used to attach a second component or may be used alone to stiffen the first component. The preform and the first component are uncured, whereas the second component is cured prior to assembly. The preform is positioned on the first component, adhesive optionally being located between the preform and the first component. Z-pins are driven through the base of the preform and into the first component, the pins extending into the base and the first component. The second component is attached to the leg of the preform. A vacuum bag and tooling are used while curing the first component and the preform and the preform to the first component. The second component may be bonded or fastened to the preform.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Inventors: Larry R. Bersuch, Ross A. Benson, Patrick D. Sheahen, Charles M. Rodenberger
  • Publication number: 20030042659
    Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.
    Type: Application
    Filed: August 28, 2001
    Publication date: March 6, 2003
    Inventors: Ross A. Benson, Larry R. Bersuch, Harry R. Miller, Ronald P. Schmidt, Linas Repecka
  • Publication number: 20030037867
    Abstract: A method is provided for using a three-dimensional, Pi-shaped, woven preform to assemble first and second composite components. The preform is infused with resin, and at least one surface of the preform is adhered to at least one surface of the first component using a film adhesive. The preform is cured while an oversized tool coated with non-stick material is located within a clevis formed by two legs of the preform. A removable peel ply is located between the tool and the clevis, and semi-rigid over-presses are used during curing. After curing, the tool, over-presses, and peel ply are removed, and adhesive is injected into the clevis. The second component is inserted into the clevis, the adhesive adhering to an inner surface of the clevis and to at least one surface of the second component for retaining the second component within the clevis, the second component having a smaller width than the tool.
    Type: Application
    Filed: August 23, 2001
    Publication date: February 27, 2003
    Inventors: Larry R. Bersuch, Dan V. Heap, Ross A. Benson
  • Publication number: 20020192450
    Abstract: A three-dimensional weave architecture for weaving preforms has fill fibers woven to provide layer-to-layer interlocking of layers of warp fiber as well as interlocking of fibers within each layer. The woven preform transfers out-of-plane loading through directed fibers to minimize inter-laminar tension. The preform has a base and at least one leg extending from the base, the base and leg each having at least two layers of warp fibers. The fill fibers follow a weave sequence which carries them through part of the base, then into the legs, then through the other portion of the base, and back through the base to return to the starting point of the fill tow. The leg may be connected at a single- or distributed-column intersection, and the intersection may be radiussed. The outer ends of the base and legs may have tapers formed from terminating layers of warp fibers in a stepped pattern.
    Type: Application
    Filed: June 15, 2001
    Publication date: December 19, 2002
    Inventors: Ronald P. Schmidt, Larry R. Bersuch, Ross A. Benson, Amir Islam