Abstract: A splint product for forming a hard structure about a body portion is provided. The splint product includes a unitary assembly of moisture-impervious outer and inner layers with an outer substrate layer, a resin impregnated substrate that hardens when exposed to moisture, and an inner substrate layer disposed between these moisture-impervious layers. Padding is adhered to the moisture-impervious inner layer opposite said resin impregnated substrate so that the padding is in contact with a patient's skin. Another aspect of the present invention is a method for activating the splint product by exposing the outer substrate layer and/or the resin impregnated substrate to moisture. This may be done by removing the moisture-impervious outer layer and spraying water on the outer substrate layer or by holding the moisture-impervious inner and outer layers together to form a pouch and pouring water into this pouch.

Abstract: An adhesive wafer is disclosed having a thin barrier layer of soft, pliant adhesive material with particles of one or more hydrocolloids dispersed therein. A flexible and preferably stretchable cover layer extends along one side of the barrier layer and a removable release sheet protects the opposite side of the barrier layer. The wafer has a central zone and a relatively large outer zone surrounding that central zone, with the material of the barrier layer in the outer zone having generally uniform molecular orientations in radial directions over an arc of 360 degrees and being of relatively uniform tensile strength in all such radial directions. Also disclosed are injection/compression molding methods for making such wafers.

Abstract: An adhesive wafer is disclosed having a thin barrier layer of soft, pliant adhesive material with particles of one or more hydrocolloids dispersed therein. A flexible and preferably stretchable cover layer extends along one side of the barrier layer and a removable release sheet protects the opposite side of the barrier layer. The wafer has a central zone and a relatively large outer zone surrounding that central zone, with the material of the barrier layer in the outer zone having generally uniform molecular orientations in radial directions over an arc of 360 degrees and being of relatively uniform tensile strength in all such radial directions. Also disclosed are injection/compression molding methods for making such wafers.