Patents by Inventor Larry R. Stadelman

Larry R. Stadelman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode component
    Patent number: 10340424
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: July 2, 2019
    Assignee: GE Lighting Solutions, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Light emitting diode component
    Patent number: 10309587
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: June 4, 2019
    Assignee: GE Lighting Solutions, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, Jr., Thomas F. Soules
  • LIGHT EMITTING DIODE COMPONENT
    Publication number: 20180080614
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: May 3, 2013
    Publication date: March 22, 2018
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, JR., Thomas F. Soules
  • LIGHT EMITTING DIODE COMPONENT
    Publication number: 20140328046
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 6, 2014
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • LIGHT EMITTING DIODE COMPONENT
    Publication number: 20140049965
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: October 24, 2013
    Publication date: February 20, 2014
    Applicant: GE LIGHTING SOLUTIONS, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Light emitting diode component
    Patent number: 8436380
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: May 7, 2013
    Assignee: GE Lighting Solutions, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Light emitting diode component
    Patent number: 8362695
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: January 29, 2013
    Assignee: GE Lighting Solutions, LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • LIGHT EMITTING DIODE COMPONENT
    Publication number: 20110018014
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: September 17, 2010
    Publication date: January 27, 2011
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • LIGHT EMITTING DIODE COMPONENT
    Publication number: 20110001422
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Application
    Filed: September 17, 2010
    Publication date: January 6, 2011
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
  • Light emitting diode component
    Patent number: 7800121
    Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: September 21, 2010
    Assignee: Lumination LLC
    Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac