Abstract: A plastic closure for a container includes a top wall portion, an annular skirt portion depending from the top wall portion, and a removal tab projecting downwardly from the skirt portion for manipulation of the closure during removal. A sealing plug depends from the inside surface of the top wall portion for disposition generally within the mouth of an associated container. The closure includes a pair of weakened regions which extend along the skirt portion on respective opposite sides of the removal tab, and which further extend along the closure top wall portion on respective opposite sides of the sealing plug.

Abstract: A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be provided, and positioned on an associated substrate for positioning adjacent an inside surface of the top wall portion of the closure of the package. In one embodiment, the mounting substrate is provided in the form of a disc-shaped sealing liner for the closure. In an alternate embodiment, the mounting substrate is laminated to an associated sealing liner, with the substrate, and microelectronics assembly positioned thereon, inserted together with the sealing liner into the associated molded closure.

Abstract: A composite closure includes a plastic outer closure cap, and an inner sealing liner positioned adjacent to an inside surface of a top wall portion of the outer cap. In order to enhance sealing integrity with an associated container, the liner is configured to include inward and outwardly facing sealing surfaces, with the provision of an annular sealing bead providing a top/side seal with an associated container, and an annular sealing plug fitting within the mouth of an associated container for providing an inside seal. The closure construction has been found to maintain sealing integrity with an associated container when the closure and container package is subjected to relatively high temperatures.

Abstract: A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be positioned within a mold cavity within which a plastic closure is subsequently molded. The microelectronics assembly is thus integrated with the closure, such as by disposition on either the exterior or interior of a top wall portion of the closure. The closure can be provided with a sealing liner positioned adjacent an inside surface of the top wall portion.

Abstract: A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be provided, and positioned on an associated substrate for positioning adjacent an inside surface of the top wall portion of the closure of the package. In one embodiment, the mounting substrate is provided in the form of a disc-shaped sealing liner for the closure. In an alternate embodiment, the mounting substrate is laminated to an associated sealing liner, with the substrate, and microelectronics assembly positioned thereon, inserted together with the sealing liner into the associated molded closure.

Abstract: A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be provided by formation on an inside surface of the top wall portion of the closure of the package. After formation of the assembly, it is contemplated that a sealing liner be positioned within the closure so that the microelectronics assembly is positioned between the top wall portion and the sealing liner.