Abstract: A bond pad is provided for improving the reliability of the bond joints between a surface-mounted integrated circuit package and a conductor on a circuit board substrate. In particular, the reliability of the bond joints is promoted by preventing the bond pad from being placed upside down on the conductor, wherein a material mismatch occurs between the bond pad and the aluminum alloy wire used to electrically connect the package leads to the bond pad, and between the bond pad and the conductor patterned on the substrate. To avoid such a mismatch, the bond pad is configured such that it cannot be picked up with conventional vacuum-operated pick and place devices when delivered upside down to the loading station. As a result, only properly oriented bond pads will be placed on the circuit board, such that the bond pad properly presents the appropriate bond surfaces to the conductor and wire during assembly.