Patents by Inventor Larry W. Mayes

Larry W. Mayes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for providing automated sample preparation for plan view transmission electron microscopy
    Patent number: 7479399
    Abstract: A system and method is described for providing automated sample preparation for plan view transmission electron microscopy. A sample wafer is microcleaved from a semiconductor wafer and mounted on a first support stub. Then the sample wafer is cut with an automated diamond sawing tool to expose a cross sectional view of the sample wafer. The sample wafer is removed from the first support stub and rotated to orient the sample wafer for plan view imaging. The rotated sample wafer is then remounted on a second support stub and cut with the automated diamond sawing tool to expose a plan view surface of the rotated sample wafer. The remounted sample wafer is subsequently prepared for focused ion beam (FIB) milling and plan view transmission electron microscopy imaging.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: January 20, 2009
    Assignee: National Semiconductor Corporation
    Inventors: Mark Alan Johnson, Larry W. Mayes
  • System and method for providing automated sample preparation for plan view transmission electron microscopy
    Patent number: 7250318
    Abstract: A system and method is described for providing automated sample preparation for plan view transmission electron microscopy. A sample wafer is microcleaved from a semiconductor wafer and mounted on a first support stub. Then the sample wafer is cut with an automated diamond sawing tool to expose a cross sectional view of the sample wafer. The sample wafer is removed from the first support stub and rotated to orient the sample wafer for plan view imaging. The rotated sample wafer is then remounted on a second support stub and cut with the automated diamond sawing tool to expose a plan view surface of the rotated sample wafer. The remounted sample wafer is subsequently prepared for focused ion beam (FIB) milling and plan view transmission electron microscopy imaging.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: July 31, 2007
    Assignee: National Semiconductor Corporation
    Inventors: Mark Alan Johnson, Larry W. Mayes