Abstract: A heat sink includes mounting feet, a plurality of folds, and a clip. Each of the folds has a base portion, and the clip couples at least two of the folds together to inhibit fanning in at least a contact region defined by adjacent base portions. An apparatus includes a printed circuit board, mounting receptacles on the printed circuit board, a heat sink, and a device package. The heat sink includes feet adapted to interface with the mounting receptacles, a plurality of folds, and a base portion defined between the folds. The device package is coupled to the printed circuit board. The base portion of the heat sink contacts at least a portion of the device package.