Abstract: Examples of devices for providing cooling solutions are described. One example device includes a substrate, one or more integrated circuit (IC) chips placed on the substrate, and a boilerplate including one or more rails. At least one rail of the one or more rails includes a recess in a surface of the at least one rail that faces the one or more IC chips. The recess includes outer walls contacting the one or more IC chips and forming a cavity for accommodating a thermal interface material (TIM) coupled to the one or more IC chips.

Abstract: Examples of devices for providing cooling solutions are described. One example device includes a boilerplate, a printed circuit board (PCB), one or more integrated circuit (IC) chips placed on the PCB, a thermal interface material (TIM), and one or more gaskets. The TIM is placed between the boilerplate and at least one IC chip of the one or more IC chips. The TIM is coupled to a surface of at least the IC chip that faces the boilerplate. The one or more gaskets are placed between the boilerplate and the PCB and encompassing the TIM. The one or more gaskets are configured to seal the at least one IC chip to provide a protective barrier for the TIM.

Abstract: Examples of devices for providing cooling solutions are described. One example device includes a substrate, one or more integrated circuit (IC) chips placed on the substrate, and a boilerplate including one or more rails. At least one rail of the one or more rails includes a recess in a surface of the at least one rail that faces the one or more IC chips. The recess includes outer walls contacting the one or more IC chips and forming a cavity for accommodating a thermal interface material (TIM) coupled to the one or more IC chips.

Abstract: Examples of devices for providing cooling solutions are described. One example device includes a boilerplate, a printed circuit board (PCB), one or more integrated circuit (IC) chips placed on the PCB, a thermal interface material (TIM), and one or more gaskets. The TIM is placed between the boilerplate and at least one IC chip of the one or more IC chips. The TIM is coupled to a surface of at least the IC chip that faces the boilerplate. The one or more gaskets are placed between the boilerplate and the PCB and encompassing the TIM. The one or more gaskets are configured to seal the at least one IC chip to provide a protective barrier for the TIM.

Abstract: A battery includes a housing, an anode in the housing, a cathode in the housing, and a separator between the cathode and the anode. The housing has a surface adjacent to the cathode. The surface defines an opening, such as an elongated opening, adapted to facilitate a generally non-circular flux of gas on a portion of the cathode. The battery can provide relatively high current density and relatively high capacity.