Patents by Inventor Lars Böwer

Lars Böwer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250062175
    Abstract: A method for producing a substrate for a semiconductor module includes: forming a first electrically conductive layer on a first side of a dielectric insulation layer; structuring the first electrically conductive layer by creating one or more incisions through the first electrically conductive layer that extend from an upper surface of the first electrically conductive layer down to the dielectric insulation layer, thereby completely separating different sections of the first electrically conductive layer; and forming a passivation layer covering the entire upper surface of the structured first electrically conductive layer.
    Type: Application
    Filed: August 13, 2024
    Publication date: February 20, 2025
    Inventors: Charles Rimbert-Riviere, Georg Troska, Lydia Lottspeich, Martin Goldammer, Ulrich Wilke, Benedikt Domes, Lars Böwer
  • Patent number: 8835299
    Abstract: A sintered connection is formed by pressing a semiconductor die against a substrate with a dried sintering material interposed between the substrate and the semiconductor die, the dried sintering material having sintering particles and a solvent. The substrate is heated to a temperature below a sintering temperature of the dried sintering material while the semiconductor die is pressed against the substrate to form local sinter connections between adjacent ones of the sintering particles. The local sinter connections collectively provide a stable joint that fixes the semiconductor die to the substrate prior to sintering. A sintered connection is then formed between the semiconductor die and the substrate from the dried sintering material, after the stable joint is formed.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: September 16, 2014
    Assignee: Infineon Technologies AG
    Inventors: Roland Speckels, Lars Böwer, Nicolas Heuck, Niels Oeschler
  • Publication number: 20140061909
    Abstract: A sintered connection is formed by pressing a semiconductor die against a substrate with a dried sintering material interposed between the substrate and the semiconductor die, the dried sintering material having sintering particles and a solvent. The substrate is heated to a temperature below a sintering temperature of the dried sintering material while the semiconductor die is pressed against the substrate to form local sinter connections between adjacent ones of the sintering particles. The local sinter connections collectively provide a stable joint that fixes the semiconductor die to the substrate prior to sintering. A sintered connection is then formed between the semiconductor die and the substrate from the dried sintering material, after the stable joint is formed.
    Type: Application
    Filed: August 29, 2012
    Publication date: March 6, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Roland Speckels, Lars Böwer, Nicolas Heuck, Niels Oeschler