Abstract: A carrier layout comprising a substrate comprising a ground plane layer and a coplanar waveguide interconnect disposed onto the substrate. The coplanar waveguide interconnect comprises a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The coplanar conductors of the pair are electrically connected to each other by at least one conducting island that is isolated from the ground plane layer. The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate having a ground plane layer, the interconnect structure comprising a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The conductors of the pair are electrically connected by at least one conducting island that is isolated from the ground plane layer.

Abstract: A carrier layout comprising a substrate comprising a ground plane layer and a coplanar waveguide interconnect disposed onto the substrate. The coplanar waveguide interconnect comprises a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The coplanar conductors of the pair are electrically connected to each other by at least one conducting island that is isolated from the ground plane layer. The present invention also provides an interconnect structure for coupling an electronic unit to an optical device disposed on a substrate having a ground plane layer, the interconnect structure comprising a pair of coplanar conductors and a central conductor disposed between the pair of coplanar conductors. The conductors of the pair are electrically connected by at least one conducting island that is isolated from the ground plane layer.

Abstract: An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.

Abstract: The present disclosure relates to an optical module comprising a carrier substrate including first electrical connection terminals on a first surface and second electrical connection terminals on a second surface electrically connected to the first electrical connection terminals. The second electrical connection terminals are connectable to a circuit carrier. The optical module further comprises an optically transparent carrier including first electrical connection terminals, and an optical element electrically connected to the optically transparent carrier.

Abstract: The present disclosure relates to an optical module comprising a carrier substrate including first electrical connection terminals on a first surface and second electrical connection terminals on a second surface electrically connected to the first electrical connection terminals. The second electrical connection terminals are connectable to a circuit carrier. The optical module further comprises an optically transparent carrier including first electrical connection terminals, and an optical element electrically connected to the optically transparent carrier.

Abstract: An optical sub-assembly is disclosed, having a mating end adapted to receive a mating fiber, and a back end provided with a converging lens establishing an expanded beam interface with an optical device. The use of an expanded beam interface provides greatly improved stability, and reduces the sensitivity to slight misalignments The optical sub-assembly comprises a receptacle for which the manufacturer thereof has full control over the optical interfaces and refractive index boundaries. The receptacle and the optical device may be manufactured separately.

Abstract: The present invention relates to an optoelectrical unit for converting information signals between an electrical signal format and an optical signal format. The proposed unit includes a circuit board, which contains at least one optoelectrical capsule. Each capsule is positioned on the circuit board, such that its footprint towards the circuit board has a smaller area than the area of a largest side of the capsule. Moreover, each capsule includes a feedthrough, which electrically connects one or more components therein to circuitry on the circuit board via a plurality of leads. The feedthrough also contains a shield, which electrically shields at least one signal lead from at least one auxiliary lead. The feedthrough is adapted for positioning the optoelectrical capsule at an arbitrary adapted location on the circuit board.

Abstract: An integrated device is provided having both laser and modulator sections. The laser section generates a primary light signal using a distributed feedback process. The modulator section influences the primary light signal by means of an electroabsorption process. The laser and modulator sections are electrically separated from each other with respect to anode and cathode areas. As a result, a single supply voltage can be used to operate the device. An optical transmitter contains, in addition to the integrated device, a protocol converter which receives an information signal to be transmitted and generates a control signal which is received by a modulator driver. Based thereon, the modulator driver produces a modulating signal, which causes a modulated light signal representing the information signal to be output. A laser bias control unit controls the output power level of the primary light signal based on a leak signal from the laser section.