Abstract: An optical-electrical substrate for providing electrical and optical connections to a photonic integrated circuit (PIC) includes a glass body with glass optical waveguides along an upper surface, and electrically conductive vias extending through a portion of the glass body from an intermediate surface to a lower surface. The intermediate surface is arranged at an elevation positioned between the upper and lower surfaces, and may optionally support redistribution layers and an electrical integrated circuit. An optical-electrical substrate may be fabricated by defining glass optical waveguides along an upper surface of a glass body, and forming electrically conductive vias through the glass body from the intermediate surface to the lower surface.

Abstract: A device for testing the contents of a switch cabinet following installation of equipment components (2a-2e) according to a plan and the wiring thereof via terminals (6) provided therefor by means of designated electrical cables (5), includes a camera unit (7) for the at least two-dimensional image capture of the components (2a-2e) fully installed and wired on an installation board (4) of a switch cabinet (1). The device can further include an evaluation unit (8) for carrying out a comparison between an imaged layout (100), on the basis of the image capture, of the actual state with a provided plan layout (200) of the target state.

Abstract: Matched fiber optic connectors are formed by aligning separate fiber bodies and then cutting optical fibers secured in the separate fiber bodies. The matched pair of fiber optic connectors are capable of supporting high-fiber count connectivity. The process includes placing optical fibers into a first fiber body aligned with a second fiber body with the optical fibers traversing a predetermined gap between the first end face and the second end face of the fiber bodies and securing the optical fibers to the fiber bodies using an adhesive. The optical fibers are cut at the predetermined gap between the aligned end faces of respective fiber bodies, thereby creating a first fiber optic connector having the first ends of the cut optical fibers matched and suitable for optical mating with the second ends of the cut optical fibers in a second fiber optic connector.

Abstract: Technologies are provided for database modification using a script component. In some embodiments, a method comprises executing, by a computing system comprising at least one processor, a script component comprising one or more functions to transform a database. The method also includes modifying, by the computing system, the database based on at least one transformation defined by the one or more functions in response to executing the script component.

Abstract: Systems and methods for training a neural radiance field model for noisy scenes can leverage raw noisy images in linear high dynamic range color space to train a neural radiance field model to generate view synthesis of low light and/or high contrast scenes. The trained model can then be utilized to accurately complete view rendering tasks without the preprocessing used for generating low dynamic range images. In some implementations, training on unprocessed data of a low light scene can allow for training a neural radiance field model to generate high quality view renderings of a low light scene.

Abstract: Anti-sparkle substrates include a plurality of features extending from a first major surface of the anti-sparkle substrate. In aspects, a feature of the plurality of features includes a feature concentration of one or more of silver, rubidium, or cesium that is non-zero at the first major surface and is greater than a corresponding concentration of a region of the first major surface excluding the plurality of features. In aspects, a feature of the plurality of features includes a gradient refractive index profile. A feature refractive index of the feature at the first major surface is greater than a substrate refractive index by about 0.03 or more. Methods include exposing a plurality of portions of a first major surface of a substrate to a source of one or more of silver ions, rubidium ions, or cesium ions to form a plurality of features in that include the plurality of portions.

Abstract: The invention relates to a method for machining at least one switchgear cabinet including: providing at least one switchgear cabinet which is constructed in several parts and comprises at least one detachably mounted component; disassembling and removing the detachably mounted component from the switch cabinet; machining the disassembled and removed component and providing the machined component for reassembly on the associated switch cabinet; and re-assigning the machined component provided for reassembly to the corresponding control cabinet, wherein the at least one switch cabinet has an individual machine-readable switch cabinet identification and the at least one removably mounted component has an individual machine-readable component identification, which are assigned to one another, wherein re-assigning the component to the switch cabinet comprising machine-reading of the machine-readable identifications and bringing together the component and the switch cabinet which have the mutually assigned iden

Abstract: The low-loss ion exchanged (IOX) waveguide disclosed herein includes a glass substrate having a top surface and comprising an alkali-aluminosilicate glass with between 3 and 15 mol % of Na2O and a concentration of Fe of 20 parts per million (ppm) or less. The glass substrate includes a buried Ag—Na IOX region, wherein this region and a surrounding portion of glass substrate define the IOX waveguide. The IOX waveguide has an optical loss OL?0.05 dB/cm and a birefringence magnitude |B|?0.001. The glass substrate with multiple IOX waveguides can be used as an optical backplane for systems having optical functionality and can find use in data center and high-performance data transmission applications.

Abstract: Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.

Abstract: An electro-optical assembly is provided. The electro-optical assembly includes a module having a module substrate, with the module substrate having a module waveguide. The electro-optical assembly also includes a circuit board having a circuit board substrate, with the circuit board substrate having a circuit board waveguide. The electro-optical assembly also includes at least one integrated circuit proximate to the module. The module is assembled to the circuit board so that the circuit board waveguide is aligned with the module waveguide for optical coupling.

Abstract: A fiber optic cable manager is provided configured to receive at least one optical fiber optically connecting one or more fiber optic adapters to a fiber optic device. The fiber optic cable manager includes a base, a sidewall extending from the base and defining a cable input opening and a cable output opening, at least one cable optically connecting one or more fiber optic adapters to an opto-electronic device, and a plurality of mandrels extending from the base and interior to the sidewall, the plurality of mandrels and the sidewall are configured to limit bending of the at least one optical to greater than a predetermined bend radius.

Abstract: Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).

Abstract: The low-loss ion exchanged (IOX) waveguide disclosed herein includes a glass substrate having a top surface and comprising an alkali-aluminosilicate glass with between 3 and 15 mol % of Na2O and a concentration of Fe of 20 parts per million (ppm) or less. The glass substrate includes a buried Ag—Na IOX region, wherein this region and a surrounding portion of glass substrate define the IOX waveguide. The IOX waveguide has an optical loss OL?0.05 dB/cm and a birefringence magnitude |B|?0.001. The glass substrate with multiple IOX waveguides can be used as an optical backplane for systems having optical functionality and can find use in data center and high-performance data transmission applications.

Abstract: Systems and methods are provided for connection of an optical fiber to a substrate. The substrate may comprise waveguide(s), guide pin(s), and a substrate body. The guide pin(s) define a first and second end and comprise a capture feature proximate the second end. The substrate body comprises a receiving feature configured to receive and connect the first end of guide pin(s), and the second end of guide pin(s) extends outwardly from the substrate body. The system also comprises a connector configured to receive the optical fiber and including a receiver portion that has a locking feature and defines a recess configured to receive the guide pin(s). The capture feature is configured to engage with the locking feature. When the capture feature is engaged with the locking feature, the optical fiber is aligned with the optical waveguide(s) and restrained from movement relative to the substrate.

Abstract: An optical assembly includes stacked planar lightwave circuit (PLC) members each having a plurality of waveguides in a respective plane, to provide optical connections to two-dimensional arrays of external optical waveguides (e.g., optical fiber cores), with one array including non-coplanar groups of waveguides having group members that are alternately arranged in a lateral direction. An optical assembly may provide optical connections between array of cores having a different pitch and/or orientation to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: A system and method for mounting a modular switch cabinet equipment in a switch cabinet housing (6) includes a computer-aided assistance unit (1) for determining a production-efficient assembly step sequence. The system and method further include at least one display unit (11-11?) for image and/or text information, which is installed at the assembly site for at least one fitter (M) in order to visualize manual assembly steps (A; B; D) of the determined assembly step sequence. The system and method further includes at least one input unit (12-12?) for acknowledgement of the completed assembly step (A; B; D) by the fitter (M).

Abstract: Systems and methods are provided for aligning a substrate with an optical fiber. A system comprises an optical fiber and a substrate with one or more optical waveguides, guide pin(s), and a substrate body comprising a receiving feature configured to receive and connect with the guide pin(s). The system also comprises an adapter having a pair of opposing walls defining a spacing therebetween. The adapter is configured to receive and connect to the substrate body in between the pair of opposing walls. The system also comprises a plug defining a hole(s) that is configured to receive the guide pin(s). The plug is configured to receive and connect the optical fiber. Connection of the adapter and the substrate body and connection of the adapter and the plug restrain movement of the optical fiber relative to the substrate.

Abstract: Waveguide substrate connection systems and methods are provided herein. An example waveguide assembly comprises a first substrate having a first waveguide, a second substrate having a second waveguide, an adhesive, and one or more spacers. A height for the one or more spacers is less than 10 ?m. The adhesive and the one or more spacers provide a composite material configured to assist in securing the first substrate and the second substrate together to align the first waveguide and the second waveguide. When the first substrate and the second substrate are attached together via the adhesive, the one or more spacers are configured to maintain a desired gap spacing therebetween so as to optimize coupling efficiency between the first waveguide and the second waveguide. The desired gap spacing corresponds to the height for the one or more spacers.

Abstract: An optical assembly includes stacked first and second planar lightwave circuit (PLC) members each having a plurality of waveguides in respective first and second planes, to provide optical connections between a two-dimensional array and a one-dimensional array of external optical waveguides (e.g., optical fiber cores). Inner faces of first and second PLC members are arranged facing one another and with the first and second planes (corresponding to the pluralities of first and second waveguides, respectively) being non-parallel. An optical assembly may provide optical connections between arrays of cores having a different pitch to serve as a fanout interface. Methods for fabricating an optical assembly are further provided.

Abstract: A method and a system for collecting and processing of life cycle information about a switch cabinet (1) of an industrial plant, with a documentation server (2) for linking data sheet information (A) of the built-in modules (9a-9c) installed in the switch cabinet (1) on the basis of the planned construction (4) with function information (B) about their use in the context of the switch cabinet equipment, in order to store this information in a central archive database (3) under an individual switch cabinet identification (8) in data records, wherein test and acceptance information (C) of the switch cabinet (1) is added to the data records of the central archive database (3) via the documentation server (2).