Abstract: Thermal cameras exist at price points and volume manufacturing suitable for practical consideration of integration of thermal camera modules into host electronic devices, including automobiles, PED's—smartphones, tablets, etc. However, individual thermal cameras require extensive unit-specific data to provision and operate each individual camera with acceptable performance. This along with non-standard electrical interfaces, are adoption barriers to host device manufacturers, for example, where some devices, including some PED's, have become bus-based platforms allowing for functional modules to be packaged into common PED's and operated by way of apps. Some modern PED's, for example, include standard high-speed data busses and low-speed control busses. Devices and methods are disclosed for delivering compatibility with standard internal interfaces and storing the camera module's unit-specific data in a memory element on the camera module.

Abstract: Thermal cameras exist at price points and volume manufacturing suitable for practical consideration of integration of thermal camera modules into host electronic devices, including automobiles, PED's—smartphones, tablets, etc. However, individual thermal cameras require extensive unit-specific data to provision and operate each individual camera with acceptable performance. This along with non-standard electrical interfaces, are adoption barriers to host device manufacturers, for example, where some devices, including some PED's, have become bus-based platforms allowing for functional modules to be packaged into common PED's and operated by way of apps. Some modern PED's, for example, include standard high-speed data busses and low-speed control busses. Devices and methods are disclosed for delivering compatibility with standard internal interfaces and storing the camera module's unit-specific data in a memory element on the camera module.

Abstract: Devices and methods that result in very low stress circuit die attachment to substrates such as PCB's and flex circuits are described. Stress, due to thermal expansion mismatches, is reduced by reducing the amount of die bonding area that is covered by adhesive material. In some instances, the area left uncovered by adhesive material may be all or partially filled with a low viscosity material that may also be thermally conductive, such as thermal grease. Reducing the contact area between the die and inherently low elasticity adhesives reduces the mechanical effect of thermal mismatches between the die and the substrate. The provided techniques are particularly beneficial when used to bond uncooled thermal imaging FPA dies to substrates.

Abstract: Thermal cameras exist at price points and volume manufacturing suitable for practical consideration of integration of thermal camera modules into host electronic devices, including automobiles, PED's—-smartphones, tablets, etc. However, individual thermal cameras require extensive unit-specific data to provision and operate each individual camera with acceptable performance. This along with non-standard electrical interfaces, are adoption barriers to host device manufacturers, for example, where some devices, including some PED's, have become bus-based platforms allowing for functional modules to be packaged into common PED's and operated by way of apps. Some modern PED's, for example, include standard high-speed data busses and low-speed control busses. Devices and methods are disclosed for delivering compatibility with standard internal interfaces and storing the camera module's unit-specific data in a memory element on the camera module.

Abstract: Thermal cameras exist at price points and volume manufacturing suitable for practical consideration of integration of thermal camera modules into host electronic devices, including automobiles, PED's—smartphones, tablets, etc. However, individual thermal cameras require extensive unit-specific data to provision and operate each individual camera with acceptable performance. This along with non-standard electrical interfaces, are adoption barriers to host device manufacturers, for example, where some devices, including some PED's, have become bus-based platforms allowing for functional modules to be packaged into common PED's and operated by way of apps. Some modern PED's, for example, include standard high-speed data busses and low-speed control busses. Devices and methods are disclosed for delivering compatibility with standard internal interfaces and storing the camera module's unit-specific data in a memory element on the camera module.

Abstract: Devices and methods that result in very low stress circuit die attachment to substrates such as PCB's and flex circuits are described. Stress, due to thermal expansion mismatches, is reduced by reducing the amount of die bonding area that is covered by adhesive material. In some instances, the area left uncovered by adhesive material may be all or partially filled with a low viscosity material that may also be thermally conductive, such as thermal grease. Reducing the contact area between the die and inherently low elasticity adhesives reduces the mechanical effect of thermal mismatches between the die and the substrate. The provided techniques are particularly beneficial when used to bond uncooled thermal imaging FPA dies to substrates.