Abstract: Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.

Abstract: The invention addresses the lack of comprehensive and quantitative methods for measurements of unwanted visual “mura” effects in displays and image sensors. Mura is generated by errors that are significantly smaller than what is needed for the function of the device, and sometimes smaller than the random variations in the patterns or structures. Capturing essentially all mura defects in a workpiece in a short time requires a daunting combination of sensitivity, statistical data reduction and speed. The invention devices an inspection method, e.g. optical, which maximizes the sensitivity to mura effects and suppresses artifacts from the mura inspection hardware itself and from noise. It does so by scanning the sensor, e.g. a high-resolution camera, creating a region of high internal accuracy across the mura effects. One important example is for mura related to placement errors, where a stage with better than 10 nanometer precision within a 100 mm range is created.

Abstract: Devices and methods for manufacturing displays, solar panels and other devices using larger size workpieces are provided. The workpiece is rolled into a cylinder, thereby reducing the physical size by a factor of 3 in one dimension. The stages on which the workpieces are rolled have a cylindrical shape, which allows a more robust and/or compact movement of the glass, reduced machine weight. The workpieces are relatively thin, more flexible, and are rolled onto a cylinder with a diameter of about 1 meter.

Abstract: The present invention relates to a method for determining the coordinates of an arbitrarily shaped pattern in a deflector system. The method basically comprises the steps of: moving the pattern in a first direction (X), calculating the position of the edge of the pattern by counting the number of micro sweeps, performed in a perpendicular direction (Y), until the edge is detected, and determining the coordinates by relating the number of counted micro sweeps to the speed of the movement of the pattern. The invention also relates to software implementing the method.

Abstract: The present invention relates to a method for determining the coordinates of an arbitrarily shaped pattern in a deflector system. The method basically comprises the steps of: moving the pattern in a first direction (X), calculating the position of the edge of the pattern by counting the number of micro sweeps, performed in a perpendicular direction (Y), until the edge is detected, and determining the coordinates by relating the number of counted micro sweeps to the speed of the movement of the pattern. The invention also relates to software implementing the method.

Abstract: Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.

Abstract: The invention addresses the lack of comprehensive and quantitative methods for measurements of unwanted visual “mura” effects in displays and image sensors. Mura is generated by errors that are significantly smaller than what is needed for the function of the device, and sometimes smaller than the random variations in the patterns or structures. Capturing essentially all mura defects in a workpiece in a short time requires a daunting combination of sensitivity, statistical data reduction and speed. The invention devices an inspection method, e.g. optical, which maximizes the sensitivity to mura effects and suppresses artifacts from the mura inspection hardware itself and from noise. It does so by scanning the sensor, e.g. a high-resolution camera, creating a region of high internal accuracy across the mura effects. One important example is for mura related to placement errors, where a stage with better than 10 nanometer precision within a 100 mm range is created.

Abstract: The present invention relates to a method for determining the coordinates of an arbitrarily shaped pattern in a deflector system. The method basically comprises the steps of: moving the pattern in a first direction (X), calculating the position of the edge of the pattern by counting the number of micro sweeps, performed in a perpendicular direction (Y), until the edge is detected, and determining the coordinates by relating the number of counted micro sweeps to the speed of the movement of the pattern. The invention also relates to software implementing the method.

Abstract: The present invention relates to a method for adjusting a pattern to be imaged onto a workpiece. The pattern representing an image is divided in a plurality of regions. A pattern density in said plurality of region is computed. At least one feature in at least one of said plurality of regions is adjusted based on the pattern density in at least one other region. An adjusted pattern is fed to a modulator. The image is created on said workpiece by using said corrected pattern. The invention also relates to an apparatus for imaging adjusted pattern on a workpiece, a semiconducting wafer to be imaged with an adjusted pattern and a mask or a reticle to be imaged with an adjusted pattern.

Abstract: Devices and methods for manufacturing displays, solar panels and other devices using larger size workpieces are provided. The workpiece is rolled into a cylinder, thereby reducing the physical size by a factor of 3 in one dimension. The stages on which the workpieces are rolled have a cylindrical shape, which allows a more robust and/or compact movement of the glass, reduced machine weight. The workpieces are relatively thin, more flexible, and are rolled onto a cylinder with a diameter of about 1 meter.

Abstract: Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.

Abstract: The present invention relates to a pattern generating apparatus for writing a pattern on a surface of an object, comprising: a stage having an object having a thickness (T) being provided with a surface, said surface being divided into a number of measurement points, where two adjacent measurement points being spaced a distance apart not exceeding a predetermined maximum distance; means to determine the gradient of the surface at each measurement point; means to calculate a 2-dimensional local offset (d) in the x-y plane for each measurement point as a function of the gradient, and the thickness (T) of object; and means to correct the pattern to be written on said surface by using the 2-dimensional local offset (d). The invention also relates to an apparatus for measuring the physical properties of a surface.

Abstract: The present invention relates to a method for calibrating a metrology stage in at least two dimensions using an artefact plate having marks forming a pattern, comprising the steps of: placing the artefact plate on the metrology stage in at least three positions, assuming the geometrical properties of the metrology stage and the artefact plate, and the positions of the artefact plate for each measurement, forming a model predicting the measurements of the artefact plate, measuring the marks by the metrology stage, and inverting said model to improve the assumptions on metrology stage and artefact plate.

Abstract: The present invention relates to a method for writing a pattern on a surface intended for use in exposure equipment, including the steps of: arranging an object having a thickness (T) provided with a surface on a stage of a pattern generating apparatus, dividing the surface into a number of measurement points, where two adjacent measurement points being spaced a distance (P) apart not exceeding a predetermined maximum distance, determining the gradient of the surface at each measurement point, calculating a 2-dimensional local offset (d) in the x-y plane for each measurement point as a function of the gradient, and the thickness (T) of object, and correcting the pattern to be written on said surface by using the 2-dimensional local offset (d). The invention also relates to a method for measuring the physical properties of a surface.

Abstract: The present invention relates to a method for calibrating a metrology stage in at least two dimensions using an artefact plate having marks forming a pattern, comprising the steps of: placing the artefact plate on the metrology stage in at least three positions, assuming the geometrical properties of the metrology stage and the artefact plate, and the positions of the artefact plate for each measurement, forming a model predicting the measurements of the artefact plate, measuring the marks by the metrology stage, and inverting said model to improve the assumptions on metrology stage and artefact plate.

Abstract: The present invention relates to a method for adjusting a pattern to be imaged onto a workpiece. The pattern representing an image is divided ina plurality of regions. A pattern density in said plurality of region is computed. At least one feature in at least one of said plurality of regions is adjusted based on the pattern density in at least one other region. An adjusted pattern is fed to a modulator. The image is created on said workpiece by using said corrected pattern. The invention also relates to an apparatus for imaging adjusted pattern on a workpiece, a semiconducting wafer to be imaged with an adjusted pattern and a mask or a reticle to be imaged woth an adjusted pattern.

Abstract: The present invention relates to a pattern generating apparatus for writing a pattern on a surface of an object, comprising: a stage having an object having a thickness (T) being provided with a surface, said surface being divided into a number of measurement points, where two adjacent measurement points being spaced a distance apart not exceeding a predetermined maximum distance; means to determine the gradient of the surface at each measurement point; means to calculate a 2-dimensional local offset (d) in the x-y plane for each measurement point as a function of the gradient, and the thickness (T) of object; and means to correct the pattern to be written on said surface by using the 2-dimensional local offset (d). The invention also relates to an apparatus for measuring the physical properties of a surface.

Abstract: An instrument configured and arranged to detect a change in thickness or refractive index of a thin film substrate. A method for optimizing the instrument and a method for detecting a change in thickness or refractive index of a thin film substrate.

Abstract: Instrument configured and arranged to detect the presence or amount of an analyte of interest on the substrate of an optical device. The instrument has a source of linearly polarized, monochromatic light positioned at an angle other than Brewster's angle relative to the substrate; and an analyzer positioned at the same angle relative to the substrate at a location suitable for detecting reflected polarized light from the substrate; wherein the analyzer is configured and arranged to approximately maximize the change in intensity of the light reflected from the substrate that is transmitted through the analyzer when a change in mass occurs at the substrate relative to an unreacted surface.