Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Abstract: A method for operating a micromechanical inertial sensor, including: translating an acceleration into a deflection of two detection electrodes that are displaced in opposite directions; ascertaining a difference in the spacing of the two detection electrodes; converting the difference in the spacing into an acceleration value using a scaling factor; and applying a linearization process to the acceleration value.

Abstract: A micromechanical component for a pressure and inertial sensor device. The component includes a substrate having an upper substrate surface; a diaphragm having an inner diaphragm side oriented towards the upper substrate surface and an outer diaphragm side pointing away from the upper substrate surface, the inner diaphragm side bordering on an inner volume, in which a reference pressure is enclosed, and the diaphragm being able to be warped using a pressure difference between a pressure prevailing on its outer diaphragm side and the reference pressure; and a seismic mass situated in the inner volume, a sensor electrode, which projects out on the inner diaphragm side and extends into the inner volume, being displaceable with respect to the substrate due to a warping of the diaphragm. A pressure and inertial sensor device, and a method of manufacturing a micromechanical component for a pressure and inertial sensor device, are also described.

Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Abstract: A micromechanical sensor device and a corresponding production method. The micromechanical sensor device has a substrate which has a front side and a rear side. Formed on the front side, at a lateral distance, are an inertial sensor region having an inertial structure for acquiring external accelerations and/or rotations, and a pressure sensor region having a diaphragm region for acquiring an external pressure. A micromechanical function layer by which the diaphragm region is formed in the pressure sensor region. A micromechanical function layer is applied on the micromechanical function layer, the inertial structure being formed out of the second and third micromechanical function layer. A cap device encloses a first predefined reference pressure in a first cavity in the inertial sensor region, and a second cavity is formed underneath the diaphragm region.

Abstract: A micromechanical system which includes a movably suspended mass. The micromechanical system includes a damping system, the damping system including a movably suspended damping structure, the damping structure being deflectable by applying a voltage. The damping structure is designed in such a way that a frequency response and/or a damping of the movably suspended mass are/is changeable with the aid of a deflection of the damping structure.

Abstract: A micromechanical inertial sensor, having a substrate; and a seismic mass which is connected to the substrate and developed so that it has a detection capability of a low-g acceleration of approximately 1 g in a first Cartesian coordinate direction, and the seismic mass is furthermore developed so that it has a detection capability of a high-g acceleration of at least approximately 100 g in at least one second Cartesian coordinate direction.

Abstract: A method for manufacturing a MEMS element, including the following: forming a least one stationary weight element and at least one moving weight element in the MEMS element, and positioning at least one fixing element at the stationary weight element and at the moving weight element, the fixing element being formed so as to be able to be severed.

Abstract: A micromechanical inertial sensor, having a substrate; and a seismic mass which is connected to the substrate and developed so that it has a detection capability of a low-g acceleration of approximately 1 g in a first Cartesian coordinate direction, and the seismic mass is furthermore developed so that it has a detection capability of a high-g acceleration of at least approximately 100 g in at least one second Cartesian coordinate direction.

Abstract: A method for operating a micromechanical inertial sensor, including: translating an acceleration into a deflection of two detection electrodes that are displaced in opposite directions; ascertaining a difference in the spacing of the two detection electrodes; converting the difference in the spacing into an acceleration value using a scaling factor; and applying a linearization process to the acceleration value.

Abstract: A micromechanical sensor is provided having a substrate having a main plane of extension and having a movable element, the movable element being pivotable about an axis of rotation that is essentially parallel to the main plane of extension, from a rest position into a deflected position, the movable element having an asymmetrical mass distribution relative to the axis of rotation, so that, as a function of a force exerted on the movable element oriented essentially perpendicular to the main plane of extension, a deflection movement of the movable element is produced in the form of a pivot movement about the axis of rotation, the micromechanical sensor having a damping element, the damping element being pivotable about the axis of rotation, the damping element being connected to the movable element so as to be capable of rotational movement, or the damping element being integrated with the movable element.

Abstract: An interposer is provided which is made up of a flat carrier substrate including at least one front wiring plane, in which front terminal pads are formed for mounting a component on the interposer, including at least one rear wiring plane, in which rear terminal pads are formed for mounting on a component carrier, the front terminal pads and the rear terminal pads being arranged offset from each other; and including vias for electrical connection of the at least one front wiring plane and the at least one rear wiring plane. The carrier substrate includes at least one edge section and at least one center section, which are at least largely mechanically decoupled via a stress-decoupling structure. The front terminal pads are arranged exclusively on the center section for mounting the component, while the rear terminal pads are arranged exclusively on the edge section for mounting on a component carrier.

Abstract: A method for manufacturing a MEMS element, including the following: forming a least one stationary weight element and at least one moving weight element in the MEMS element, and positioning at least one fixing element at the stationary weight element and at the moving weight element, the fixing element being formed so as to be able to be severed.

Abstract: A micromechanical acceleration sensor is provided, including a substrate, a first seismic mass, which is movably suspended on the substrate and deflectable in an acceleration acting on the substrate in a first direction, first detection means for detecting a deflection of the first seismic mass in an acceleration acting on the substrate in the first direction, a second seismic mass, which is movably suspended on the substrate and deflectable in an acceleration acting on the substrate in a second direction, the second direction running perpendicularly to the first direction, second detection means for detecting a deflection of the second seismic mass in an acceleration acting on the substrate in the second direction, the second seismic mass furthermore being deflectable in an acceleration acting on the substrate in a third direction, the third direction running perpendicularly to the first direction and to the second direction, and third detection means for detecting a deflection of the second seismic mass

Abstract: For the targeted influencing of the internal pressure within a cavity between two elements of a component, a getter material or an outgassing material is situated in an additional cavity between the two elements. After the two elements are bonded to one another, the additional cavity is still to be joined via a connecting opening to the cavity. The getter material or the outgassing material is then activated so that gasses are bound in the additional cavity and in the connected cavity, or an outgassing takes place. Only when the sought internal pressure has established itself in the connected cavity is the connecting opening to the additional cavity closed. In this way, the getter material or the outgassing material is only used for establishing a defined internal pressure, but no longer has any influence on the internal pressure within the cavity during ongoing operation of the component.

Abstract: A micromechanical acceleration sensor is provided, including a substrate, a first seismic mass, which is movably suspended on the substrate and deflectable in an acceleration acting on the substrate in a first direction, first detection means for detecting a deflection of the first seismic mass in an acceleration acting on the substrate in the first direction, a second seismic mass, which is movably suspended on the substrate and deflectable in an acceleration acting on the substrate in a second direction, the second direction running perpendicularly to the first direction, second detection means for detecting a deflection of the second seismic mass in an acceleration acting on the substrate in the second direction, the second seismic mass furthermore being deflectable in an acceleration acting on the substrate in a third direction, the third direction running perpendicularly to the first direction and to the second direction, and third detection means for detecting a deflection of the second seismic mass

Abstract: For the targeted influencing of the internal pressure within a cavity between two elements of a component, a getter material or an outgassing material is situated in an additional cavity between the two elements. After the two elements are bonded to one another, the additional cavity is still to be joined via a connecting opening to the cavity. The getter material or the outgassing material is then activated so that gasses are bound in the additional cavity and in the connected cavity, or an outgassing takes place. Only when the sought internal pressure has established itself in the connected cavity is the connecting opening to the additional cavity closed. In this way, the getter material or the outgassing material is only used for establishing a defined internal pressure, but no longer has any influence on the internal pressure within the cavity during ongoing operation of the component.

Abstract: Method for on-chip stress decoupling to reduce stresses in a vertical hybrid integrated component including MEMS and ASIC elements and to mechanical decoupling of the MEMS structure. The MEMS/ASIC elements are mounted above each other via at least one connection layer and form a chip stack. On the assembly side, at least one connection area is formed for the second level assembly and for external electrical contacting of the component on a component support. At least one flexible stress decoupling structure is formed in one element surface between the assembly side and the MEMS layered structure including the stress-sensitive MEMS structure, in at least one connection area to the adjacent element component of the chip stack or to the component support, the stress decoupling structure being configured so that the connection material does not penetrate into the stress decoupling structure and flexibility of the stress decoupling structure is ensured.

Abstract: A micromechanical component includes: a substrate; a seismic weight joined to the substrate at a first suspension mount; at least one first electrode for measuring a motion of the seismic weight in a first direction, the first electrode being joined to the substrate at a second suspension mount; and at least one second electrode for measuring a motion of the seismic weight in a second direction different from the first direction, the second electrode being joined to the substrate at a third suspension mount. The first electrode is mechanically connected to the second suspension mount with the aid of a support arm and set apart from the second suspension mount.

Abstract: A micromechanical sensor is provided having a substrate having a main plane of extension and having a movable element, the movable element being pivotable about an axis of rotation that is essentially parallel to the main plane of extension, from a rest position into a deflected position, the movable element having an asymmetrical mass distribution relative to the axis of rotation, so that, as a function of a force exerted on the movable element oriented essentially perpendicular to the main plane of extension, a deflection movement of the movable element is produced in the form of a pivot movement about the axis of rotation, the micromechanical sensor having a damping element, the damping element being pivotable about the axis of rotation, the damping element being connected to the movable element so as to be capable of rotational movement, or the damping element being integrated with the movable element.