Abstract: An apparatus and method of providing an apparatus, the apparatus comprising: a covering portion configured to cover at least part of an electronic device; and a microphone configured to be electrically connected to the covering portion; wherein at least one electrical connection for the microphone is provided on the covering portion.

Abstract: In one example, a manufacturing method is disclosed. There is being dispensed a first dielectric layer on a ground layer. The first dielectric layer is dispensed on a three dimensional portion of a body of an apparatus configured to high frequency signals. There is being jet printed at least one signal line directly on the first dielectric layer. The at least one signal line is configured to the high frequency signals. There is being dispensed a second dielectric layer to encapsulate the at least one signal line. There is being dispensed a conductive layer on the second dielectric layer and partly on the first dielectric layer so that the conductive layer is connected to the ground layer in order to encapsulate both the first dielectric layer and the second dielectric layer. Other examples relate to a shielded multilayer high frequency signal line structure, and a mobile apparatus comprising the shielded multilayer high frequency signal line structure.

Abstract: An electronic device comprises a multi-layer printed circuit board. On the printed circuit board there is installed electronic components and a metal frame that encloses at least part of the electronic components. A layer of bonded anisotropic conductive film is disposed on the frame and the electronic components. The layer connects thermally a sheet of metal foil on the frame and on the electronic components. The sheet of metal foil covers the electronic component and the metal frame.

Abstract: An apparatus and method of providing an apparatus, the apparatus comprising: a covering portion configured to cover at least part of an electronic device; and a microphone configured to be electrically connected to the covering portion; wherein at least one electrical connection for the microphone is provided on the covering portion.