Abstract: A bendable device is provided. The device comprises: a body comprising a bending region and a flexible display stack comprising at least one active layer and a supporting layer positioned on the bottom of the flexible display stack. The supporting layer of the flexible display stack comprises one or more fastening areas; the body comprises one or more fastening components; and one or more fastening components of the body are configured to be operable in a movable connection with one or more fastening areas of the flexible display stack.

Abstract: A bendable device is provided. The device comprises: a body comprising a bending region and a flexible display stack comprising at least one active layer and a supporting layer positioned on the bottom of the flexible display stack. The supporting layer of the flexible display stack comprises one or more fastening areas; the body comprises one or more fastening components; and one or more fastening components of the body are configured to be operable in a movable connection with one or more fastening areas of the flexible display stack.

Abstract: A bendable device is provided. The device comprises: a body comprising a bending region and a flexible display stack comprising at least one active layer and a supporting layer positioned on the bottom of the flexible display stack. The supporting layer of the flexible display stack comprises one or more fastening areas; the body comprises one or more fastening components; and one or more fastening components of the body are configured to be operable in a movable connection with one or more fastening areas of the flexible display stack.

Abstract: A bendable device is provided. The device comprises: a body comprising a bending region and a flexible display stack comprising at least one active layer and a supporting layer positioned on the bottom of the flexible display stack. The supporting layer of the flexible display stack comprises one or more fastening areas; the body comprises one or more fastening components; and one or more fastening components of the body are configured to be operable in a movable connection with one or more fastening areas of the flexible display stack.

Abstract: An antenna arrangement including a ground plane having an electrical length; an antenna element positioned for coupling with the ground plane; a first conductive element; an interconnecting mechanism, connected to the ground plane and to the first conductive element, having a first configuration and a second configuration, wherein the ground plane has a first electrical length when the interconnecting mechanism is in the first configuration and a second electrical length, different to the first electrical length, when the interconnecting mechanism is in the second configuration.

Abstract: An apparatus including a radiator having an electrical length; a first conductive element; an interconnector, connected to the radiator and to the first conductive element, having a first configuration and a second configuration, wherein the radiator has a first electrical length when the interconnector is in the first configuration and a second electrical length, different to the first electrical length, when the interconnector is in the second configuration.

Abstract: Apparatus including: an antenna configured for efficient far field communication at a first frequency; an inductive element including a plurality of series-connected coiled portions, including a first coiled portion and a second coiled portion, wherein the inductive element is configured to provide near field communication at a second frequency; and at least one reactive element parallel connected between the first coiled portion and the second coiled portion, wherein the at least one reactive element has a lower impedance at the first frequency than at the second frequency.

Abstract: Apparatus including: an antenna configured for efficient far field communication at a first frequency; an inductive element including a plurality of series-connected coiled portions, including a first coiled portion and a second coiled portion, wherein the inductive element is configured to provide near field communication at a second frequency; and at least one reactive element parallel connected between the first coiled portion and the second coiled portion, wherein the at least one reactive element has a lower impedance at the first frequency than at the second frequency.

Abstract: An apparatus including a radiator having an electrical length; a first conductive element; an interconnector, connected to the radiator and to the first conductive element, having a first configuration and a second configuration, wherein the radiator has a first electrical length when the interconnector is in the first configuration and a second electrical length, different to the first electrical length, when the interconnector is in the second configuration.

Abstract: An antenna arrangement including a ground plane having an electrical length; an antenna element positioned for coupling with the ground plane; a first conductive element; an interconnecting mechanism, connected to the ground plane and to the first conductive element, having a first configuration and a second configuration, wherein the ground plane has a first electrical length when the interconnecting mechanism is in the first configuration and a second electrical length, different to the first electrical length, when the interconnecting mechanism is in the second configuration.

Abstract: A method for managing transmission conditions in a mobile telecommunication system according to movement of a mobile terminal is provided. The mobile terminal is having a communication link with a base station. The movement of the mobile terminal is monitored, and then a database is checked for the most optimal transmission conditions for the monitored movement of the mobile terminal, and action is taken to change the transmission conditions of the communication link upon detecting, in the database, transmission conditions providing a more optimal communication link for the current movement of the mobile terminal than the transmission conditions currently being used for the communication link.

Abstract: An integrated RF front-end module for use in a communications device, such as a mobile phone. The RF front-end module is made from a laminated structure consisting of a plurality of layers. At least one of the layers is used to embed RF electronics. Microvias are disposed in various layers of the laminated structure so as to provide electrical connections to the embedded RF electronics. Two electrically conductive layers are provided on both sides of the laminated structure for shielding the RF components against electromagnetic interference. An antenna has one or two radiating elements disposed on one or both sides of the laminated structures for conveying RF signals to and from the RF electronics. The antenna can be fine-tuned and the operational frequency range of the antenna can also be changed.

Abstract: An integrated circuit, such as a radio frequency integrated circuit (RFIC), has a first layer bearing first metallization patterned for defining a first inductive coil, a second layer bearing second metallization patterned for defining a second inductive coil that overlies the first inductive coil and that is magnetically coupled to the first inductive coil through a third layer interposed between the first layer and the second layer. The third layer bears third metallization for defining an electric shield or electrostatic shield. The third metallization is patterned into a plurality of structures having shapes intended to minimize eddy currents. The electric shield is connected to further metallization that carries a ground potential. The third layer may further bear other metallization for coupling together at least two components of the integrated circuit.

Abstract: A mobile telephone including a hearing aid compatible system for coupling an output of the mobile telephone to a hearing aid device of a user; and a metal detector system adapted to detect a metal object brought into proximity relative to the mobile telephone.

Abstract: A laminated structure that can be used as an add-on card removably disposed on an electronic device, such as a mobile phone. The laminated structure has a number of layers laminated together for embedding one or more RF-chips. Advantageously, one or more layers are made of FR4 boards, each of which has a dielectric core layer between two electrically conductive foils. One of the layers has one or more openings for securing the embedded RF-chips with a bonding material such as epoxy. The electrically conductive foils on the inner layers can be etched or otherwise removed to form electrical circuits. Micro-vias can be provided through the various layers for interconnecting the electrical circuits and the RF-chips. The electrically conductive foils on the outer layers of the laminated structure can be used to provide electromagnetic shielding to the RF-chips.

Abstract: An integrated RF front-end module for use in a communications device, such as a mobile phone. The RF front-end module is made from a laminated structure consisting of a plurality of layers. At least one of the layers is used to embed RF electronics. Microvias are disposed in various layers of the laminated structure so as to provide electrical connections to the embedded RF electronics. Two electrically conductive layers are provided on both sides of the laminated structure for shielding the RF components against electromagnetic interference. An antenna has one or two radiating elements disposed on one or both sides of the laminated structures for conveying RF signals to and from the RF electronics. The antenna can be fine-tuned and the operational frequency range of the antenna can also be changed.

Abstract: A laminated structure that can be used as an add-on card removably disposed on an electronic device, such as a mobile phone. The laminated structure has a number of layers laminated together for embedding one or more RF-chips. Advantageously, one or more layers are made of FR4 boards, each of which has a dielectric core layer between two electrically conductive foils. One of the layers has one or more openings for securing the embedded RF-chips with a bonding material such as epoxy. The electrically conductive foils on the inner layers can be etched or otherwise removed to form electrical circuits. Micro-vias can be provided through the various layers for interconnecting the electrical circuits and the RF-chips. The electrically conductive foils on the outer layers of the laminated structure can be used to provide electromagnetic shielding to the RF-chips.

Abstract: A method for forming a spiral inductor (11) or component of a transformer, compatible with very large scale integrated processing, that achieves a higher Q value without occupying more space by splitting at least one turn (13 51) as two or more crisscrossing or interwoven smaller-width turns (13a 13b 52 53 54 55). The at least one turn (51) may, for example, be split into four turns paired up to provide two pairs of two turns, and the turns of each pair may then be interwoven or crisscrossed, and then the two pairs may also be interwoven or crisscrossed. The splitting of a turn into two or more smaller-width turns results in the current being divided among the smaller-width turns.

Abstract: An integrated circuit, such as a radio frequency integrated circuit (RFIC), has a first layer bearing first metallization patterned for defining a first inductive coil, a second layer bearing second metallization patterned for defining a second inductive coil that overlies the first inductive coil and that is magnetically coupled to the first inductive coil through a third layer interposed between the first layer and the second layer. The third layer bears third metallization for defining an electric shield or electrostatic shield. The third metallization is patterned into a plurality of structures having shapes intended to minimize eddy currents. The electric shield is connected to further metallization that carries a ground potential. The third layer may further bear other metallization for coupling together at least two components of the integrated circuit.

Abstract: The invention relates to a matching circuit for adapting an amplifier to load impedance at various output power levels of the amplifier, and a method for adapting the amplifier to load impedance at various output power levels of the amplifier. The matching circuit comprises an LC circuit, i.e. an electric circuit switching consisting of at least one coil and at least one capacitor for tuning harmonic signals resulting from amplifier non-linearities. At least one capacitor of the LC circuit (600, 602, 604, 606) is an adjustable microelectromechanical (MEMS) capacitor (602, 606). The LC circuit comprises an interface for receiving control signals (220) adjusting capacitance of the microelectromechanical (MEMS) capacitor. The control signals (220) adjust the capacitance of the microelectromechanical (MEMS) capacitor (602, 606) such that the LC circuit (600, 602, 604, 606) resonates at the frequency of the harmonic signal to be tuned.