Abstract: An antenna arrangement operable at a first resonant frequency f having a corresponding resonant wavelength ? the antenna arrangement comprising: an antenna comprising a feed; a ground plane coupled to the antenna comprising a first region and a second region; and a grounded conductive structure coupled to the first region of the ground plane, wherein the second region of the ground plane is configured such that, at the first resonant frequency f the current flows predominantly in the grounded conductive structure compared to the second region of the ground plane.

Abstract: An antenna arrangement operable at a first resonant frequency f having a corresponding resonant wavelength ? the antenna arrangement comprising: an antenna comprising a feed; a ground plane coupled to the antenna comprising a first region and a second region; and a grounded conductive structure coupled to the first region of the ground plane, wherein the second region of the ground plane is configured such that, at the first resonant frequency f the current flows predominantly in the grounded conductive structure compared to the second region of the ground plane.

Abstract: An integrated circuit, such as a radio frequency integrated circuit (RFIC), has a first layer bearing first metallization patterned for defining a first inductive coil, a second layer bearing second metallization patterned for defining a second inductive coil that overlies the first inductive coil and that is magnetically coupled to the first inductive coil through a third layer interposed between the first layer and the second layer. The third layer bears third metallization for defining an electric shield or electrostatic shield. The third metallization is patterned into a plurality of structures having shapes intended to minimize eddy currents. The electric shield is connected to further metallization that carries a ground potential. The third layer may further bear other metallization for coupling together at least two components of the integrated circuit.

Abstract: An integrated circuit, such as a radio frequency integrated circuit (RFIC), has a first layer bearing first metallization patterned for defining a first inductive coil, a second layer bearing second metallization patterned for defining a second inductive coil that overlies the first inductive coil and that is magnetically coupled to the first inductive coil through a third layer interposed between the first layer and the second layer. The third layer bears third metallization for defining an electric shield or electrostatic shield. The third metallization is patterned into a plurality of structures having shapes intended to minimize eddy currents. The electric shield is connected to further metallization that carries a ground potential. The third layer may further bear other metallization for coupling together at least two components of the integrated circuit.