Abstract: A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.

Abstract: An assembly is provided having a first circuit board and a second circuit board, each circuit board having a plurality of electrical connection points, electrical connection points on the first circuit board being connected to specified electrical connection points on the second circuit board by solder structures, the first and second circuit boards being stacked with respect to each other and with a defined standoff distance there between, the assembly comprising one or more stops having an inserted portion placed between the first and second circuit board along the perimeter of at least one of the electrical circuit boards, the inserted portion of each of the stops having a fixed, predetermined height.

Abstract: A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.

Abstract: A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus includes a field replaceable apparatus and a receiving apparatus and attenuates EMI. By integrating mechanical, electrical, and thermal management features the modular integrated apparatus improves the process of repairing and upgrading the processor at a customer site by simplifying the modular integrated apparatus package. Additionally, by reducing the number of parts and the amount of circuit board space required to connect a processor to a thermal plate, the present embodiment improves ease of use and acts as a handle in its own installation and removal.

Abstract: A modular integrated apparatus and method that integrates mechanical, electrical, and thermal management, and that includes a computer processor (CPU), or VLSI module, connected to a circuit board and a thermal plate. The modular integrated apparatus includes a field replaceable apparatus and a receiving apparatus and attenuates EMI. By integrating mechanical, electrical, and thermal management features the modular integrated apparatus improves the process of repairing and upgrading the processor at a customer site by simplifying the modular integrated apparatus package. Additionally, by reducing the number of parts and the amount of circuit board space required to connect a processor to a thermal plate, the present embodiment improves ease of use and acts as a handle in its own installation and removal.

Abstract: An integrated circuit chip 12 is temporarily associated with a plenum 16 having a fluid chamber 88 in which a heat transfer fluid 46 is circulated in order to heat or cool the chip 12 at a predetermined temperature sufficient to complete a burn-in screening of said chip.