Patents by Inventor Lateef Mustapha

Lateef Mustapha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive device with a thermal interface material
    Patent number: 8592972
    Abstract: Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: November 26, 2013
    Assignee: Intel Corporation
    Inventors: Lakshmi Supriya, Jessica A Weninger, Leonel Arana, Lateef Mustapha
  • METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL
    Publication number: 20130140014
    Abstract: Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).
    Type: Application
    Filed: January 30, 2013
    Publication date: June 6, 2013
    Inventors: Lakshmi Supriya, Jessica A. Weninger, Leonel Arana, Lateef Mustapha
  • Methods of processing a thermal interface material
    Patent number: 8383459
    Abstract: Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: February 26, 2013
    Assignee: Intel Corporation
    Inventors: Lakshmi Supriya, Jessica Weninger, Leonel Arana, Lateef Mustapha
  • METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL
    Publication number: 20090317641
    Abstract: Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).
    Type: Application
    Filed: June 24, 2008
    Publication date: December 24, 2009
    Inventors: Lakshmi Supriya, Jessica Weninger, Leonel Arana, Lateef Mustapha
  • Flux precoated solder preform for thermal interface material
    Publication number: 20080239660
    Abstract: In one embodiment, an apparatus comprises a semiconductor device, a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises a pre-coated flux material.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 2, 2008
    Inventors: Lateef Mustapha, Carl Deppisch, Anna Prakash, Sai Jayaraman, Mike Reiter